Inventor
Moon Il Kim
Inventor
Suwon-si, KR
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices19%
H05KPrinted circuits15%
Y10TTechnical subjects covered by former us classification12%
Y02PClimate change mitigation technologies in the production or processing of goods4%
A23LFoods, foodstuffs or non-alcoholic beverages, not otherwise provided for2%
A23VIndexing scheme relating to foods, foodstuffs or non-alcoholic beverages and lactic or propionic acid bacteria used in foodstuffs or food preparation2%
A61KPreparations for medical, dental or toiletry purposes2%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations2%
C12QMeasuring or testing processes involving enzymes, nucleic acids or microorganisms2%
PatentTitleYear
11,000,501Composition for preventing or treating neurological and mental disorders, containing syringaresinol202110,818,604Semiconductor package202010,811,328Semiconductor package202010,734,335Electronic component package202010,347,613Fan-out semiconductor package201910,304,791Electronic component package201910,177,100Fan-out semiconductor package201910,020,272Electronic component package20189,853,003Fan-out semiconductor package20179,543,076'Electronic component and method of manufacturing the same'20179,386,701'Electronic component embedded printed circuit board'20169,357,646'Package substrate'20168,929,091'Method of manufacturing a printed circuit board (PCB)'20158,759,021'Microorganism for quantifying homocysteine, and use thereof'20148,482,890'PCB strip and manufacturing method for electronic component embedded PCB'20138,184,448'Bare chip embedded PCB'20128,011,086'Method of manufacturing a component-embedded printed circuit board'20117,947,906'Printed circuit board and manufacturing method thereof'20117,697,301'Printed circuit board having embedded electronic components and manufacturing method thereof'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2020Patents assigned to SAMSUNG ELECTRO MECH (15)· patent assignee history
2010–2016Based in Daejeon, KR· patent location history
2011Based in Daeleon, KR· patent location history
2012–2015Patents assigned to KIM MOON-IL (3)· patent assignee history
2012–2015Patents assigned to HAN KYUNG-JIN (2)· patent assignee history
2012–2015Patents assigned to KIM HYUNG-TAE (2)· patent assignee history
2012–2015Patents assigned to LEE DOO-HWAN (2)· patent assignee history
2017–2020Based in Suwon-si, KR· patent location history
2020Based in Gyeonggi-do, KR· patent location history
2021Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRO MECH | 15 | 2010–2020 |
| KIM MOON-ILself | 3 | 2012–2015 |
| HAN KYUNG-JIN | 2 | 2012–2015 |
| KIM HYUNG-TAE | 2 | 2012–2015 |
| LEE DOO-HWAN | 2 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 7 | 2017–2020 |
| Daejeon, KR | 7 | 2010–2016 |
| Daeleon, KR | 2 | 2011 |
| Seoul, KR | 1 | 2021 |
| Gyeonggi-do, KR | 1 | 2020 |