Inventor
Kenichi Watatani
Inventor
Itami, JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material14%
H01LSemiconductor devices14%
H10DInorganic electric semiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
C04BLime, magnesia13%
H01JElectric discharge tubes or discharge lamps7%
H01BCables4%
B23KSoldering or unsoldering3%
B28BShaping clay or other ceramic compositions3%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds3%
PatentTitleYear
11,024,744Semiconductor device and method for manufacturing the same202110,894,744Oxide sintered material and method for manufacturing the same, sputtering target, and method for manufacturing semiconductor device202110,822,276Oxide sintered material and method of manufacturing the same, sputtering target, and method of manufacturing semiconductor device202010,811,238Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device202010,655,213Oxide sintered material, method of producing oxide sintered material, sputtering target, and method of producing semiconductor device202010,480,060Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device201910,475,631Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device201910,262,844Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device201910,192,994Oxide semiconductor film including indium, tungsten and zinc and thin film transistor device201910,087,517Oxide sintered body and semiconductor device20189,957,604Oxide sintered body and method for manufacturing the same, sputtering target, and semiconductor device20189,187,376'Sintered compact, cutting tool formed using sintered compact, and method for manufacturing sintered compact'20158,338,744'Condensing optical system, laser processing method and apparatus, and manufacturing method of brittle material blank'20127,807,942'Laser processing method and laser processing apparatus'20106,745,092'Product management system, and host computer and recorded medium used in the system'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004Patents assigned to NIKKO MATERIALS CO LTD (1)· patent assignee history
2004Based in Kitaibaraki, JP· patent location history
2010–2021Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (13)· patent assignee history
2010Based in Osaka, JP· patent location history
2012Patents assigned to FUSE KEIJI (1)· patent assignee history
2012Patents assigned to KOBAYASHI YUTAKA (1)· patent assignee history
2012Patents assigned to SUMITOMO ELEC HARDMETAL CORP (1)· patent assignee history
2012–2021Based in Itami, JP· patent location history
2015Based in Hyogo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SUMITOMO ELECTRIC INDUSTRIES | 13 | 2010–2021 |
| FUSE KEIJI | 1 | 2012 |
| KOBAYASHI YUTAKA | 1 | 2012 |
| NIKKO MATERIALS CO LTD | 1 | 2004 |
| SUMITOMO ELEC HARDMETAL CORP | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Itami, JP | 12 | 2012–2021 |
| Hyogo, JP | 1 | 2015 |
| Osaka, JP | 1 | 2010 |
| Kitaibaraki, JP | 1 | 2004 |