Inventor

Takayuki Matsuzaki

Inventor

Ichihara, JP

Overview

2006–2017

Patent span

Electricity

Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C09Jprimary

C09JAdhesives16%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%

Y10TTechnical subjects covered by former us classification15%

LOC1313%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%

C08LCompositions of macromolecular compounds7%

H01LSemiconductor devices7%

H05KPrinted circuits5%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds3%

G11BInformation storage based on relative movement between record carrier and transducer3%

PatentTitleYear

D0804435'Flap in an adhesive tape for semiconductor manufacturing'2017 9,190,309'Tape for processing wafer, method for manufacturing tape for processing'2015 9,076,832'Wafer processing tape, method of manufacturing wafer processing tape, and method of manufacturing semiconductor device'2015 9,076,833'Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device'2015 8,975,161'Dicing/die bonding integral film, dicing/die bonding integral film manufacturing method, and semiconductor chip manufacturing method'2015 D0690278'Adhesive tape for semiconductor manufacturing'2013 D0689831'Adhesive tape for semiconductor manufacturing'2013 8,470,115'Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device'2013 8,465,615'Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device'2013 D0680505'Adhesive tape for semiconductor manufacturing'2013 D0664512'Adhesive tape for semiconductor manufacturing'2012 D0664511'Adhesive tape for semiconductor manufacturing'2012 D0656910'Adhesive tape for semiconductor manufacturing'2012 D0656909'Adhesive tape for semiconductor manufacturing'2012 8,119,737'Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device'2012 7,947,779'Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer'2011 7,538,965'Method and apparatus for writing servo management information in a disk drive'2009 7,517,724'Dicing/die bonding sheet'2009 7,457,074'Method and apparatus for correcting errors while writing spiral servo information in a disk drive'2008 7,070,670'Adhesive composition, method for preparing the same, adhesive film using the same, substrate for carrying semiconductor and semiconductor device'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2017Patents assigned to HITACHI CHEMICAL CO LTD (17)· patent assignee history

2006–2017Based in Ichihara, JP· patent location history

2008–2009Based in Hamura, JP· patent location history

2012–2015Patents assigned to MATSUZAKI TAKAYUKI (13)· patent assignee history

2012–2015Patents assigned to MASHINO MICHIO (11)· patent assignee history

2012–2015Patents assigned to KATOU RIE (10)· patent assignee history

2012–2015Patents assigned to KATOU SHINYA (10)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI CHEMICAL CO LTD	17	2006–2017
MATSUZAKI TAKAYUKIself	13	2012–2015
MASHINO MICHIO	11	2012–2015
KATOU RIE	10	2012–2015
KATOU SHINYA	10	2012–2015

Locations

Location	Patents	Span
Ichihara, JP	18	2006–2017
Hamura, JP	2	2008–2009