Inventor
Takashi Yoshie
Inventor
Nagano, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
A47JKitchen equipment7%
B60JWindows, windscreens, non-fixed roofs, doors, or similar devices for vehicles7%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for7%
C25DProcesses for the electrolytic or electrophoretic production of coatings7%
H01LSemiconductor devices7%
H05BElectric heating7%
H05KPrinted circuits7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
9,466,556'Lead frame and semiconductor device'20168,581,379'Lead frame and semiconductor device'20138,283,759'Lead frame having outer leads coated with a four layer plating'20127,408,248'Lead frame for semiconductor device'20087,190,057'Packaging component and semiconductor package'20076,593,643'Semiconductor device lead frame'20036,196,625'Sliding roof apparatus'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001Patents assigned to AISIN SEIKI (1)· patent assignee history
2001Based in Aichi, JP· patent location history
2003–2016Patents assigned to SHINKO ELECTRIC IND CO (6)· patent assignee history
2003–2016Based in Nagano, JP· patent location history
2012–2013Patents assigned to YOSHIE TAKASHI (2)· patent assignee history
2012Patents assigned to KADOSAKI KOUICHI (1)· patent assignee history
2013Patents assigned to KURE MUNEAKI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINKO ELECTRIC IND CO | 6 | 2003–2016 |
| YOSHIE TAKASHIself | 2 | 2012–2013 |
| AISIN SEIKI | 1 | 2001 |
| KADOSAKI KOUICHI | 1 | 2012 |
| KURE MUNEAKI | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nagano, JP | 6 | 2003–2016 |
| Aichi, JP | 1 | 2001 |