Inventor
Kozo Harada
Inventor
Tokyo, JP
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H05KPrinted circuits13%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H01LSemiconductor devices12%
Y10TTechnical subjects covered by former us classification6%
C21DModifying the physical structure of ferrous metals6%
C22CAlloys6%
C23CCoating metallic material5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
B21CManufacture of metal sheets, wire, rods, tubes, profiles or like semi-manufactured products otherwise than by rolling3%
PatentTitleYear
10,801,085High-strength steel sheet and method for manufacturing the same202010,727,145Semiconducter device with filler to suppress generation of air bubbles and electric power converter202010,720,368Semiconductor device and method for manufacturing same202010,714,415Semiconductor device and method of manufacturing the same202010,655,194High-strength steel sheet and method for producing the same202010,494,693High-strength steel sheet and method for producing the same201910,468,315Power module201910,461,045Power semiconductor device201910,283,444Semiconductor device and method of manufacturing the same20199,920,394'Bake-hardening galvanized steel sheet'20189,831,166Semiconductor device20179,627,293'Semiconductor device and heat-conductive sheet'20179,576,890'Semiconductor device and method of manufacturing the same'20179,496,153'Semiconductor device and method of manufacturing the same'20169,449,854'Semiconductor device and method of manufacturing the same'20169,299,681'Semiconductor device and method of manufacturing'20168,963,327'Semiconductor device including wiring board with semiconductor chip'20158,928,147'Semiconductor device and method of manufacturing the same'20158,822,269'Semiconductor device and method of manufacturing the same'20148,581,410'Semiconductor device and method of manufacturing the same'20138,575,757'Semiconductor device and method of manufacturing the same'20138,461,688'Semiconductor device and method of manufacturing the same'20138,314,495'Semiconductor device and method of manufacturing the same'20128,018,066'Semiconductor device and method of manufacturing the same'20117,791,204'Semiconductor device and method of manufacturing the same'20107,745,258'Manufacturing method of semiconductor device'20107,608,156'High strength cold rolled steel sheet and method for manufacturing the same'20097,599,052'Method for marking defect and device therefor'20097,521,799'Semiconductor device and method of manufacturing the same'20097,443,036'Manufacturing method of semiconductor device'20087,423,744'Method for marking defect and device therefor'20087,248,366'Method for marking defect and device therefor'20076,984,885'Semiconductor device having densely stacked semiconductor chips'20066,982,489'Semiconductor device having a plurality of laminated semiconductor elements with water absorbing resin films interposed therebetween'20066,462,425'Semiconductor device and manufacturing method thereof'20026,440,584'Hot-dip galvanized steel sheet and method for producing the same'20024,368,572'Method of manufacturing a shaft structure having a spherical bulb'1983Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2020Patents assigned to MITSUBISHI ELECTRIC CORP (6)· patent assignee history
2002–2009Patents assigned to NIPPON KOKAN KK (4)· patent assignee history
2002–2009Based in Fukuyama, JP· patent location history
2006–2010Patents assigned to RENESAS TECH CORP (6)· patent assignee history
2006–2020Based in Tokyo, JP· patent location history
2009–2020Patents assigned to JFE STEEL CORP (5)· patent assignee history
2011–2020Patents assigned to RENESAS ELECTRONICS CORP (13)· patent assignee history
2018Based in Jakarta, ID· patent location history
2019–2020Based in Chiyoda-ku, JP· patent location history
2019–2020Based in Bekasi, ID· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS ELECTRONICS CORP | 13 | 2011–2020 |
| MITSUBISHI ELECTRIC CORP | 6 | 2002–2020 |
| RENESAS TECH CORP | 6 | 2006–2010 |
| JFE STEEL CORP | 5 | 2009–2020 |
| NIPPON KOKAN KK | 4 | 2002–2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 21 | 2006–2020 |
| Chiyoda-ku, JP | 4 | 2019–2020 |
| Fukuyama, JP | 4 | 2002–2009 |
| Bekasi, ID | 3 | 2019–2020 |
| Jakarta, ID | 1 | 2018 |