Inventor
KU-FENG YANG
Inventor
TW
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H10DInorganic electric semiconductor devices10%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1010%
C25DProcesses for the electrolytic or electrophoretic production of coatings7%
B82YSpecific uses or applications of nanostructures2%
PatentTitleYear
12,484,253Metal features of a semiconductor device and methods for forming the same202512,387,996Through-substrate vias with improved connections202512,366,004Apparatus and method for wafer pre-wetting202512,362,315Heterogeneous dielectric bonding scheme202512,322,680Semiconductor device having backside interconnect structure on through substrate via202512,278,203Semiconductor structure and manufacturing method thereof202512,237,284Semiconductor structure comprising dummy feature interposed between the bonding connectors202512,227,867Plating apparatus for plating semiconductor wafer and plating method202512,131,954Selective epitaxy process for the formation of CFET local interconnection202412,132,016Bonding structures of integrated circuit devices and method forming the same202412,132,079Bonding and isolation techniques for stacked transistor structures202412,087,732Isolation bonding film for semiconductor packages and methods of forming the same202412,074,064TSV structure and method forming same202411,990,430Bonding structures of integrated circuit devices and method forming the same202411,869,869Heterogeneous dielectric bonding scheme202411,823,979Method of forming semiconductor device having backside interconnect structure on through substrate via202311,728,296Interconnect structure and method of forming same202311,721,666Isolation bonding film for semiconductor packages and methods of forming the same202311,688,639Semiconductor device and method202311,585,005Apparatus and method for wafer pre-wetting202311,585,008Plating apparatus for plating semiconductor wafer and plating method202311,527,439TSV structure and method forming same202211,296,011Through-substrate vias with improved connections2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (23)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 23 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 23 | 2022–2025 |