Inventor

CHIA-YU LIN

Inventor
TW

Overview

22→
Patents
2022–2025
Patent span
Electricity
Primary field (CPC H)

Patents· 22 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application13%
H05KPrinted circuits10%
B21DWorking or processing of sheet metal or metal tubes, rods or profiles without essentially removing material8%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact8%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution8%
Y10TTechnical subjects covered by former us classification8%
G06FElectric digital data processing6%
B81BMicrostructural devices or systems, e.g. micromechanical devices4%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems4%
PatentTitleYear
12,454,455Semiconductor structure and method of making202512,435,432Bismuth-based modified electrode, manufacturing method thereof and use thereof202512,283,568Wafer bonding alignment202512,163,745Heat dissipation device and fin structure202412,118,091Methods for securely updating software202412,054,382Roughness selectivity for MEMS movement stiction reduction202411,828,754Modified electrode, manufacturing method thereof and use thereof202311,742,320Wafer bonding alignment202311,732,981Heat dissipation device202311,725,885Heat exchanger fin and manufacturing method of the same202311,713,273Glass material with low dielectric constant and low fiberizing temperature202311,692,777Heat exchanger fin and manufacturing method of the same202311,655,138Roughness selectivity for MEMS movement stiction reduction202311,598,588Method of manufacturing a heat exchanger202311,598,587Method of manufacturing a heat exchanger202311,530,879Heat exchanger fin and manufacturing method of tHE same202211,500,084Method and apparatus for performing object detection by using detection threshold values derived from adding different offset values to reference threshold values202211,478,176Miniature and intelligent urine sensing system202211,402,163Heat dissipation device and fin structure202211,384,999Heat dissipation device202211,359,870Method of manufacturing a heat exchanger202211,345,629Glass material with low dielectric constant attributable to high weight percentage of boron trioxide2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2024Patents assigned to COOLER MASTER CO LTD (10)· patent assignee history
2022–2025Patents assigned to UNIV NAT CHENG KUNG (3)· patent assignee history
2022–2023Patents assigned to TAIWAN GLASS IND CORP (2)· patent assignee history
2022Patents assigned to MEDIATEK INC (1)· patent assignee history
2022–2025Based in TW· patent location history
2023–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
COOLER MASTER CO LTD102022–2024
TAIWAN SEMICONDUCTOR MFG CO LTD52023–2025
UNIV NAT CHENG KUNG32022–2025
TAIWAN GLASS IND CORP22022–2023
MEDIATEK INC12022
Locations
LocationPatentsSpan
TW222022–2025