LexDanaLexDanabeta
Inventor

Yie-Chuan Chiu

Inventor
Hsinchu, TW

Overview

5→
Patents
2013–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1067%
G06FElectric digital data processing17%
H01BCables17%
PatentTitleYear
10,963,118Electrode structure and touch panel thereof20218,692,390'Pyramid bump structure'20148,658,528'Bumping process and structure thereof'20148,450,049'Process for forming an anti-oxidant metal layer on an electronic device'20138,415,243'Bumping process and structure thereof'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2014Patents assigned to CHIPBOND TECHNOLOGY CORP (4)· patent assignee history
2013–2014Patents assigned to CHIU YIE-CHUAN (3)· patent assignee history
2013–2014Patents assigned to HO LUNG-HUA (3)· patent assignee history
2013–2014Patents assigned to KUO CHIH-MING (3)· patent assignee history
2013–2014Patents assigned to SHIH CHENG-HUNG (2)· patent assignee history
2013–2014Based in Hsinchu, TW· patent location history
2021Based in Chiayi County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHIPBOND TECHNOLOGY CORP42013–2014
CHIU YIE-CHUANself32013–2014
HO LUNG-HUA32013–2014
KUO CHIH-MING32013–2014
SHIH CHENG-HUNG22013–2014
Locations
LocationPatentsSpan
Hsinchu, TW42013–2014
Chiayi County, TW12021