Inventor
Hsiang Liu
Inventor
Hsinchu, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
Y10TTechnical subjects covered by former us classification17%
E21BEarth or rock drilling8%
G01VGeophysics8%
G06FElectric digital data processing8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
PatentTitleYear
10,976,470Simulation method for flow field of multi-stage fracturing on horizontal well in tight oil reservoir20216,330,355'Frame layout to monitor overlay performance of chip composed of multi-exposure images'20016,214,441'Use of wee (water edge exposure) to prevent polyimide'20016,143,644'Method to prevent passivation from keyhole damage and resist extrusion'20005,824,457'Use of WEE (wafer edge exposure) to prevent polyimide contamination'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998–2001Patents assigned to TAIWAN SEMICONDUCTOR MFG (4)· patent assignee history
1998–2001Based in Hsinchu, TW· patent location history
2001Based in Jwu Beei, TW· patent location history
2021Patents assigned to UNIV BEIJING SCIENCE & TECHNOLOGY (1)· patent assignee history
2021Based in Beijing, CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 4 | 1998–2001 |
| UNIV BEIJING SCIENCE & TECHNOLOGY | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 3 | 1998–2001 |
| Beijing, CN | 1 | 2021 |
| Jwu Beei, TW | 1 | 2001 |