Inventor

Chong Dai

Inventor

Shenzhen, CN

Overview

2013–2021

Patent span

Physics

Primary field (CPC G)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B32Bprimary

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form13%

B64FGround or aircraft-carrier-deck installations specially adapted for use in connection with aircraft13%

C03CChemical composition of glasses, glazes or vitreous enamels13%

E01DConstruction of bridges, elevated roadways or viaducts13%

G01RMeasuring electric variables13%

G02BOptical elements, systems or apparatus13%

G06FElectric digital data processing13%

G08CTransmission systems for measured values, control or similar signals13%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2013Patents assigned to DAI CHONG-QING (1)· patent assignee history

2013Patents assigned to FU TAI HUA IND SHENZHEN CO LTD (1)· patent assignee history

2013–2020Based in Shenzhen, CN· patent location history

2017Based in Beijing, CN· patent location history

2020Patents assigned to CHINA INT MARINE CONTAINERS GROUP LTD (1)· patent assignee history

2020Patents assigned to CHINA INT MARINE CONTAINERS GROUP LTD CIMC R&D CENTER (1)· patent assignee history

2021Patents assigned to CORNING INC (1)· patent assignee history

2021Based in Shanghai, CN· patent location history

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
CHINA INT MARINE CONTAINERS GROUP LTD	1	2020
CHINA INT MARINE CONTAINERS GROUP LTD CIMC R&D CENTER	1	2020
CORNING INC	1	2021
DAI CHONG-QINGself	1	2013
FU TAI HUA IND SHENZHEN CO LTD	1	2013

Locations