Inventor
Kazuhito Hosokawa
Inventor
Ibaraki, JP
Overview
Patents· 27 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
C09JAdhesives9%
G02BOptical elements, systems or apparatus8%
H01LSemiconductor devices8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
Y10TTechnical subjects covered by former us classification8%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%
H05BElectric heating4%
H10KOrganic electric solid-state devices4%
A47HFurnishings for windows or doors3%
PatentTitleYear
10,859,871Optical member, and polarizing plate set and liquid crystal display device that use said optical member202010,809,433Circularly polarizing plate for organic EL display device, and organic EL display device202010,741,776Flexible light-emitting device, lighting apparatus, and image display202010,688,759Method for manufacturing optical laminate202010,678,083Optical member comprising a polarizing plate and a low-refractive index layer having a porous layer202010,302,994Optical member20199,153,556'Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method'20159,147,861'Surface light-emitting object'20158,975,759'Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby'20158,962,379'Method of producing CIGS film, and method of producing CIGS solar cell by using same'20158,525,351'Semiconductor device, substrate for producing semiconductor device and method of producing them'20138,278,153'Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby'20128,018,044'Semiconductor device, substrate for producing semiconductor device and method of producing them'20117,943,427'Semiconductor device, substrate for producing semiconductor device and method of producing them'20117,772,040'Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby'20107,365,441'Semiconductor device fabricating apparatus and semiconductor device fabricating method'20087,262,514'Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device'20077,235,888'Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device'20077,232,709'Process for producing a semiconductor device'20077,132,755'Adhesive film for manufacturing semiconductor device'20067,115,989'Adhesive sheet for producing a semiconductor device'20067,064,011'Semiconductor device fabricating apparatus and semiconductor device fabricating method'20066,858,473'Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device'20056,312,799'Pressure-sensitive acrylic adhesive composition for adhesion of polyester film and adhesive sheets thereof'20016,261,685'Thermosetting adhesive and adhesive sheet thereof'20016,211,261'Thermosetting pressure-sensitive adhesive and adhesive sheet thereof'20016,130,269'Pressure-sensitive adhesive of (meth)acrylate, unsaturated acid, poly(meth)acrylate and epoxy resin'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2020Patents assigned to NITTO DENKO CORP (27)· patent assignee history
2000–2010Based in Osaka, JP· patent location history
2005–2020Based in Ibaraki, JP· patent location history
2008–2013Patents assigned to DAINIPPON PRINTING CO LTD (4)· patent assignee history
2012–2015Patents assigned to HOSOKAWA KAZUHITO (6)· patent assignee history
2012–2015Patents assigned to KONDO HIROYUKI (3)· patent assignee history
2012–2015Patents assigned to MATSUMURA TAKESHI (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 27 | 2000–2020 |
| HOSOKAWA KAZUHITOself | 6 | 2012–2015 |
| DAINIPPON PRINTING CO LTD | 4 | 2008–2013 |
| KONDO HIROYUKI | 3 | 2012–2015 |
| MATSUMURA TAKESHI | 3 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 22 | 2005–2020 |
| Osaka, JP | 5 | 2000–2010 |