Inventor

Charles L. Tilton

Inventor
Colton, WA, US

Overview

60→
Patents
1993–2014
Patent span
Electricity
Primary field (CPC H)

Patents· 60 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H05KPrinted circuits15%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact12%
G01RMeasuring electric variables12%
G05DSystems for controlling or regulating non-electric variables8%
B05BSpraying apparatus7%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
F02MSupplying combustion engines in general with combustible mixtures or constituents thereof3%
F25BRefrigeration machines, plants or systems3%
H02KDynamo-electric machines3%
PatentTitleYear
8,810,266'Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis'20148,671,697'Pumping system resistant to cavitation'20148,235,706'Methods and apparatus for atomization of a liquid'20128,174,828'Narrow gap spray cooling in a globally cooled enclosure'20128,076,951'Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis'20117,992,626'Combination spray and cold plate thermal management system'20117,839,031'Spray cooled motor system'20107,836,706'Thermal management system for evaporative spray cooling'20107,806,166'Insulated spray cooling system for extreme environments'20107,788,939'Azeotrope spray cooling system'20107,779,896'Passive fluid recovery system'20107,743,619'Heat exchanger system'20107,717,162'Passive fluid recovery system'20107,679,234'Spray cool means for cooling a modular inverter electric motor system'20107,665,322'Method of reducing fluid emissions from a global spray cooling system'20107,650,902'Liquid thermal management purging system'20107,621,739'Injection molding apparatus for producing an atomizer'20097,602,608'Narrow gap spray cooling in a globally cooled enclosure'20097,597,275'Methods and apparatus for atomization of a liquid'20097,506,519'Staggered spray nozzle system'20097,504,845'Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis'20097,495,914'Narrow gap spray cooling in a globally cooled enclosure'20097,490,478'Dynamic spray system'20097,469,551'Globally cooled computer system'20087,401,471'Dynamic spray system'20087,397,154'Spray cooled motor system'20087,392,660'Spray cooling system for narrow gap transverse evaporative spray cooling'20087,370,817'Actuated atomizer'20087,313,925'Atomizer for thermal management system'20087,308,801'Method of operating a spray unit'20077,301,772'Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules'20077,299,647'Spray cooling system for transverse thin-film evaporative spray cooling'20077,264,042'Spray cooling system for extreme environments'20077,216,695'Method of operating a thermal management system'20077,159,414'Hotspot coldplate spray cooling system'20077,104,078'Spray cooling system for transverse thin-film evaporative spray cooling'20067,102,374'Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis'20067,086,455'Spray cooling system'20067,078,803'Integrated circuit heat dissipation system'20067,032,403'Method of controlling spray distances in a spray unit'20067,021,067'Dynamic thermal management spray system'20067,013,662'Staggered spray nozzle system'20067,009,842'Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules'20066,976,528'Spray cooling system for extreme environments'20056,955,062'Spray cooling system for transverse thin-film evaporative spray cooling'20056,952,346'Etched open microchannel spray cooling'20056,889,515'Spray cooling system'20056,889,509'Coolant recovery system'20056,880,350'Dynamic spray system'20056,857,283'Semiconductor burn-in thermal management system'20056,108,201'Fluid control apparatus and method for spray cooling'20006,104,610'EMI shielding fluid control apparatus'20006,016,969'Laminated array of pressure swirl atomizers'20005,933,700'Method for manufacturing pressure swirl atomizers'19995,880,931'Spray cooled circuit card cage'19995,860,602'Laminated array of pressure swirl atomizers'19995,719,444'Packaging and cooling system for power semi-conductor'19985,713,327'Liquid fuel injection device with pressure-swirl atomizers'19985,314,529'Entrained droplet separator'19945,220,804'High heat flux evaporative spray cooling'1993

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1993–1994Based in Kent, WA, US· patent location history
1994–2014Patents assigned to TILTON CHARLES L (3)· patent assignee history
1998–2014Based in Colton, WA, US· patent location history
2005–2014Patents assigned to ISOTHERMAL SYSTEMS RES INC (38)· patent assignee history
2005Based in Clarkston, WA, US· patent location history
2009–2014Patents assigned to DCG SYSTEMS INC (3)· patent assignee history
2010–2014Patents assigned to PARKER HANNIFIN CORP (7)· patent assignee history
2010–2011Based in Liberty Lake, WA, US· patent location history
2011–2014Patents assigned to CADER TAHIR (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ISOTHERMAL SYSTEMS RES INC382005–2014
PARKER HANNIFIN CORP72010–2014
DCG SYSTEMS INC32009–2014
TILTON CHARLES Lself31994–2014
CADER TAHIR22011–2014
Locations
LocationPatentsSpan
Colton, Washington, US551998–2014
Liberty Lake, Washington, US22010–2011
Kent, Washington, US21993–1994
Clarkston, Washington, US12005