Inventor
Yasukazu Nakata
Inventor
Tokyo, JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G06Kprimary
G06KGraphical data reading14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
C09JAdhesives8%
Y10TTechnical subjects covered by former us classification8%
H01QAntennas, i.e. radio aerials6%
H05KPrinted circuits6%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form3%
PatentTitleYear
10,900,905Probe manufacturing method and probe202110,174,234Adhesive composition and adhesive sheet20198,952,371'Organic EL element and method for manufacturing same'20157,812,248'Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereof'20107,804,021'Light transmissible solar cell module, process for manufacturing same, and solar cell panel thereof'20107,626,548'Antenna circuit, IC inlet and IC tag'20097,397,672'Flip chip mounting substrate'20087,294,917'IC tag'20076,927,099'Process for producing semiconductor device and semiconductor device'20056,853,286'Flat coil component, characteristic adjusting method of flat coil component, ID tag, and characteristic adjusting method of ID tag'20056,765,289'Reinforcement material for silicon wafer and process for producing IC chip using said material'20046,592,973'Card and process for producing the card'20036,495,752'Electric wave shielding material'20026,369,773'Sheet antenna'20026,277,481'Adhesive composition and adhesive sheet'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2019Patents assigned to LINTEC CORP (14)· patent assignee history
2001–2007Based in Matsudo, JP· patent location history
2002Patents assigned to KEIYO ENGINEERING KK (1)· patent assignee history
2002–2019Based in Tokyo, JP· patent location history
2002Based in Chiba, JP· patent location history
2003Based in Chiyoda-ku, JP· patent location history
2015Patents assigned to ADACHI CHIHAYA (1)· patent assignee history
2015Patents assigned to NAKATA MANABU (1)· patent assignee history
2021Patents assigned to HORIBA LTD (1)· patent assignee history
2021Based in Kyoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LINTEC CORP | 14 | 2001–2019 |
| ADACHI CHIHAYA | 1 | 2015 |
| HORIBA LTD | 1 | 2021 |
| KEIYO ENGINEERING KK | 1 | 2002 |
| NAKATA MANABU | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 7 | 2002–2019 |
| Matsudo, JP | 5 | 2001–2007 |
| Kyoto, JP | 1 | 2021 |
| Chiyoda-ku, JP | 1 | 2003 |
| Chiba, JP | 1 | 2002 |