Inventor
Osami Hayashi
Inventor
Saitama, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification27%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form9%
B41MPrinting, duplicating, marking, or copying processes9%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein9%
G06KGraphical data reading9%
H01RElectrically-conductive connections9%
H05KPrinted circuits9%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h109%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests9%
PatentTitleYear
5,041,183'Method for the preparation of a hot-melt adhesive interconnector'19915,034,081'Method for the preparation of an emboss-worked plastic card'19914,917,466'Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby'19904,775,578'Colored ink ribbon of electrothermal transfer type for thermal printers'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–1991Patents assigned to SHINETSU POLYMER CO (4)· patent assignee history
1988–1991Based in Saitama, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHINETSU POLYMER CO | 4 | 1988–1991 |
Locations
| Location | Patents | Span |
|---|---|---|
| Saitama, JP | 4 | 1988–1991 |