Inventor
Frank Huussen
Inventor
Bilthoven, NL
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1031%
C23CCoating metallic material21%
F27BFurnaces, kilns, ovens or retorts in general8%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace6%
F16LPipes4%
H01LSemiconductor devices4%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation4%
Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution4%
Y02PClimate change mitigation technologies in the production or processing of goods4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
PatentTitleYear
9,837,271Process for forming silicon-filled openings with a reduced occurrence of voids20179,343,304'Method for depositing films on semiconductor wafers'20168,455,293'Method for processing solar cell substrates'20138,338,210'Method for processing solar cell substrates'20127,749,918'Method and apparatus for processing semiconductor substrates'20107,312,156'Method and apparatus for supporting a semiconductor wafer during processing'20077,273,819'Method and apparatus for processing semiconductor substrates'20077,128,570'Method and apparatus for purging seals in a thermal reactor'20067,006,900'Hybrid cascade model-based predictive control system'20066,902,395'Multilevel pedestal for furnace'20056,746,240'Process tube support sleeve with circumferential channels'20046,613,685'Method for supporting a semiconductor wafer during processing'20036,481,945'Method and device for transferring wafers'20026,468,903'Pre-treatment of reactor parts for chemical vapor deposition reactors'20026,461,439'Apparatus for supporting a semiconductor wafer during processing'20026,328,561'Method for cooling a furnace, and furnace provided with a cooling device'20016,316,371'Method for the chemical treatment of a semiconductor substrate'20016,183,565'Method and apparatus for supporting a semiconductor wafer during processing'20015,662,470'Vertical furnace'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2013Patents assigned to ASM INT (17)· patent assignee history
1997–2017Based in Bilthoven, NL· patent location history
2012Patents assigned to BOONSTRA KLAAS P (1)· patent assignee history
2012Patents assigned to GARSSEN ADRIAAN (1)· patent assignee history
2012Patents assigned to HUUSSEN FRANK (1)· patent assignee history
2012–2016Based in Almere, NL· patent location history
2016–2017Patents assigned to ASM IP HOLDING BV (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ASM INT | 17 | 1997–2013 |
| ASM IP HOLDING BV | 2 | 2016–2017 |
| BOONSTRA KLAAS P | 1 | 2012 |
| GARSSEN ADRIAAN | 1 | 2012 |
| HUUSSEN FRANKself | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Bilthoven, NL | 16 | 1997–2017 |
| Almere, NL | 3 | 2012–2016 |