Inventor
Reza M. Golzarian
Inventor
Beaverton, OR, US
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
C09KMaterials for miscellaneous applications, not provided for elsewhere15%
C09GPolishing compositions13%
H01LSemiconductor devices10%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
C09DCoating compositions, e.g. paints, varnishes or lacquers3%
C23FNon-mechanical removal of metallic material from surface3%
C25FProcesses for the electrolytic removal of materials from objects3%
PatentTitleYear
10,899,945Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt comprising substrates202110,738,219Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates202010,570,316Chemical mechanical polishing (CMP) composition202010,385,236Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and / or cobalt alloy comprising substrates201910,214,663Chemical-mechanical polishing composition comprising organic/inorganic composite particles20197,405,419'Unidirectionally conductive materials for interconnection'20087,229,484'Pre-coated particles for chemical mechanical polishing'20077,156,947'Energy enhanced surface planarization'20077,153,760'Using acoustic energy including two lasers to activate implanted species'20067,097,536'Electrically enhanced surface planarization'20067,084,053'Unidirectionally conductive materials for interconnection'20066,976,907'Polishing pad conditioning'20056,875,086'Surface planarization'20056,419,553'Methods for break-in and conditioning a fixed abrasive polishing pad'20026,406,641'Liquid etch endpoint detection and process metrology'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002Patents assigned to LUXTRON CORP (1)· patent assignee history
2002Based in Santa Clara, CA, US· patent location history
2002Based in San Francisco, CA, US· patent location history
2005–2008Patents assigned to INTEL CORP (8)· patent assignee history
2005–2008Based in Beaverton, OR, US· patent location history
2019–2021Patents assigned to BASF SE (5)· patent assignee history
2019Patents assigned to BASF CORP (1)· patent assignee history
2019Patents assigned to BASF TAIWAN LTD (1)· patent assignee history
2019–2021Based in Portland, OR, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 8 | 2005–2008 |
| BASF SE | 5 | 2019–2021 |
| BASF CORP | 1 | 2019 |
| BASF TAIWAN LTD | 1 | 2019 |
| LUXTRON CORP | 1 | 2002 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beaverton, OR, US | 8 | 2005–2008 |
| Portland, OR, US | 5 | 2019–2021 |
| Santa Clara, California, US | 1 | 2002 |
| San Francisco, California, US | 1 | 2002 |