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Inventor

Chih-Kai Yang

Inventor
Taipei, TW

Overview

45→
Patents
2007–2019
Patent span
Electricity
Primary field (CPC H)

Patents· 45 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
G06FElectric digital data processing14%
H01RElectrically-conductive connections14%
Y10TTechnical subjects covered by former us classification5%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact2%
H01LSemiconductor devices2%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry1%
B05CApparatus for applying fluent materials to surfaces, in general1%
B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers1%
PatentTitleYear
10,262,649Noise cancellation device and noise cancellation method20199,896,262'Storage box using cushion package structure'20189,873,109Catalysts for thermochemical fuel production and method of producing fuel using thermochemical fuel production20189,762,009'Plug connector insertable in two orientations and having a metallic shield plate with arms with hook structures'20179,755,380'Flippable electrical connector'20179,748,332'Non-volatile semiconductor memory'20179,740,253'Electronic apparatus'20179,727,090'Portable electronic apparatus'20179,705,267'Electrical connector with grounding plate retained therein'20179,608,391'Flippable electrical connector'20179,502,821'Flippable electrical connector'20169,482,219'Heat dissipation module'20169,472,910'Flippable electrical connector'20169,382,919'Fan blade structure'20169,350,126'Electrical connector having a receptacle with a shielding plate and a mating plug with metallic side arms'20169,332,666'Electrical connector having an improved stiffener'20169,270,035'Carrier and carrier assembly used thereof for positioning IC package'20169,214,754'Holding device used for electrical connector'20159,131,626'Electronic device including a jet flow generator'20159,119,323'Electronic device'20159,029,696'Electronic device'20158,897,012'Electronic device and heat dissipation module thereof'20148,675,821'Network audio testing system and network audio testing method thereof'20148,641,271'Method for testing heat pipes'20148,363,400'Circuit module and electronic device using the same'20138,262,419'Contact for electric connector and method of making the same'20128,033,872'Contact terminal for test socket'20118,033,854'IC socket having individual latch hinge'20117,954,541'Heat dissipation module'20117,757,627'Automatic coating device'20107,589,969'Folding protective cover for heat-conductive medium'20097,564,686'Heat-dissipating module'20097,558,062'Heat-dissipating module and electronic apparatus'20097,463,484'Heatsink apparatus'20087,457,119'Heatsink module'20087,436,673'Heat sink fixing assembly'20087,405,937'Heat sink module for dual heat sources'20087,400,507'Fastening structure'20087,388,747'Heat plate fixing structure'20087,319,592'Recyclable protective cover for a heat-conductive medium'20087,277,293'Heat sink conduction apparatus'20077,274,572'Supporting plate'20077,265,990'Chipset coupling apparatus'20077,248,474'Fool-proof device on heatsink thermal module for the notebook computer'20077,212,404'Integrated heat sink device'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007–2019Patents assigned to INVENTEC CORP (28)· patent assignee history
2007–2019Based in Taipei, TW· patent location history
2011–2016Patents assigned to HON HAI PREC IND CO LTD (6)· patent assignee history
2011Based in Tu-Cheng, TW· patent location history
2012–2014Patents assigned to YANG CHIH-KAI (3)· patent assignee history
2012–2017Based in New Taipei, TW· patent location history
2014–2019Patents assigned to INVENTEC PUDONG TECH CORP (9)· patent assignee history
2016–2017Patents assigned to FOXCONN INTERCONNECT TECHNOLOGY LTD (7)· patent assignee history
2018Based in Hsinchu, TW· patent location history
2018Based in Pasadena, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INVENTEC CORP282007–2019
INVENTEC PUDONG TECH CORP92014–2019
FOXCONN INTERCONNECT TECHNOLOGY LTD72016–2017
HON HAI PREC IND CO LTD62011–2016
YANG CHIH-KAIself32012–2014
Locations
LocationPatentsSpan
Taipei, TW292007–2019
New Taipei, TW112012–2017
Tu-Cheng, TW22011
Hsinchu, TW12018
Pasadena, California, US12018