Inventor
Chih-Sheng Chang
Inventor
Tainan, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H10DInorganic electric semiconductor devices11%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
B01FMixing, e.g. dissolving, emulsifying or dispersing5%
C01BNon-metallic elements5%
C01PIndexing scheme relating to structural and physical aspects of solid inorganic compounds5%
C09DCoating compositions, e.g. paints, varnishes or lacquers5%
G06FElectric digital data processing5%
H01BCables5%
PatentTitleYear
10,978,391Connection structure of semiconductor device and manufacturing method thereof202110,937,783Semiconductor device and manufacturing method thereof202110,930,769Semiconductor device and manufacturing method thereof202110,916,427Forming contact holes using litho-etch-litho-etch approach202110,892,235Die seal ring and manufacturing method thereof202110,875,773Method for storage or transportation of graphene oxide20208,059,398'Panel module for a computer enclosure, and the computer enclosure'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011Patents assigned to CHANG CHAO-WEN (1)· patent assignee history
2011Based in Taipei, TW· patent location history
2020Patents assigned to JMC CORP (1)· patent assignee history
2020Patents assigned to UNIV CORNELL (1)· patent assignee history
2020Based in Ithaca, NY, US· patent location history
2021Patents assigned to UNITED MICROELECTRONICS CORP (3)· patent assignee history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (2)· patent assignee history
2021Based in Tainan, TW· patent location history
2021Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 3 | 2021 |
| TAIWAN SEMICONDUCTOR MFG CO LTD | 2 | 2021 |
| CHANG CHAO-WENself | 1 | 2011 |
| JMC CORP | 1 | 2020 |
| UNIV CORNELL | 1 | 2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 3 | 2021 |
| Hsinchu, TW | 2 | 2021 |
| Ithaca, New York, US | 1 | 2020 |
| Taipei, TW | 1 | 2011 |