Inventor
Chuichi Miyazaki
Inventor
Akishima, JP
Overview
Patents· 42 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
Y10TTechnical subjects covered by former us classification14%
B23KSoldering or unsoldering7%
G01RMeasuring electric variables6%
B26BHand-held cutting tools not otherwise provided for3%
H01LSemiconductor devices3%
H10DInorganic electric semiconductor devices3%
G01BMeasuring length, thickness or similar linear dimensions1%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%
PatentTitleYear
10,002,808Semiconductor device manufacturing method and semiconductor device20189,070,560'Semiconductor chip with modified regions for dividing the chip'20158,883,566'Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure'20148,772,135'Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereof'20148,729,698'Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure'20148,546,244'Method of manufacturing semiconductor device'20138,518,744'Method of manufacturing semiconductor device'20138,378,459'Semiconductor device, semiconductor wafer and manufacturing method of the same'20138,084,334'Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region'20117,923,292'Semiconductor device'20117,892,949'Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region'20117,795,741'Semiconductor device'20107,759,224'Fabrication method of semiconductor integrated circuit device'20107,737,001'Semiconductor manufacturing method'20107,514,294'Semiconductor device and a manufacturing method of the same'20097,452,787'Fabrication method of semiconductor integrated circuit device'20087,420,284'Semiconductor device and manufacturing method thereof'20087,265,035'Semiconductor device and its manufacturing method'20077,202,570'Circuit tape having adhesive film semiconductor device and a method for manufacturing the same'20077,148,081'Method of manufacturing a semiconductor device'20067,091,620'Semiconductor device and manufacturing method thereof'20067,038,325'Wiring tape for semiconductor device including a buffer layer having interconnected foams'20066,916,686'Method of manufacturing a semiconductor device'20056,791,194'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'20046,670,215'Semiconductor device and manufacturing method thereof'20036,664,135'Method of manufacturing a ball grid array type semiconductor package'20036,645,794'Method of manufacturing a semiconductor device by monolithically forming a sealing resin for sealing a chip and a reinforcing frame by transfer molding'20036,642,083'Semiconductor device and manufacturing method thereof'20036,639,323'Semiconductor device and its manufacturing method'20036,521,981'Semiconductor device and manufacturing method thereof'20036,515,371'Semiconductor device with elastic structure and wiring'20036,472,727'Semiconductor device and manufacturing method thereof'20026,433,440'Semiconductor device having a porous buffer layer for semiconductor device'20026,365,439'Method of manufacturing a ball grid array type semiconductor package'20026,355,975'Semiconductor device and manufacturing method thereof'20026,355,500'Semiconductor device and manufacturing method thereof'20026,353,255'Semiconductor device and manufacturing method thereof'20026,342,728'Semiconductor device and manufacturing method thereof'20026,342,726'Semiconductor device and manufacturing method thereof'20026,307,269'Semiconductor device with chip size package'20016,114,753'Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same'20005,141,318'Laser interferometer type length measuring apparatus and positioning method using the same'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2004Patents assigned to HITACHI LTD (17)· patent assignee history
1992Based in Tsukuba, JP· patent location history
2000–2013Based in Akishima, JP· patent location history
2001–2005Patents assigned to HITACHI ULSI SYS CO LTD (6)· patent assignee history
2003–2010Patents assigned to RENESAS TECH CORP (12)· patent assignee history
2009–2018Based in Tokyo, JP· patent location history
2011–2018Patents assigned to RENESAS ELECTRONICS CORP (11)· patent assignee history
2011–2014Patents assigned to MIYAZAKI CHUICHI (6)· patent assignee history
2013–2014Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 17 | 1992–2004 |
| RENESAS TECH CORP | 12 | 2003–2010 |
| RENESAS ELECTRONICS CORP | 11 | 2011–2018 |
| HITACHI ULSI SYS CO LTD | 6 | 2001–2005 |
| MIYAZAKI CHUICHIself | 6 | 2011–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Akishima, JP | 28 | 2000–2013 |
| Tokyo, JP | 9 | 2009–2018 |
| Kanagawa, JP | 4 | 2013–2014 |
| Tsukuba, JP | 1 | 1992 |