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Inventor

Takeshi Shioga

Inventor
Kawasaki, JP

Overview

63→
Patents
2003–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 63 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10DInorganic electric semiconductor devices16%
H01GCapacitors12%
H05KPrinted circuits12%
Y10TTechnical subjects covered by former us classification8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H01LSemiconductor devices4%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact4%
H10BElectronic memory devices3%
G01RMeasuring electric variables2%
PatentTitleYear
11,044,830Loop heat pipe and electronic device202111,009,927Loop heat pipe, method of manufacturing the same, and electronic device202110,881,021Loop heat pipe and fabrication method therefor, and electronic device202010,624,238Loop heat pipe and manufacturing method for loop heat pipe and electronic device202010,420,253Loop heat pipe, manufacturing method thereof, and electronic device20199,711,433'Semiconductor device, method of manufacturing the same, and electronic device'20179,476,914'Interconnection card for inspection, manufacture method for interconnection card, and inspection method using interconnection card'20169,455,212'Loop heat pipe system and information processing apparatus'20169,142,476'Semiconductor package, cooling mechanism and method for manufacturing semiconductor package'20158,780,560'Loop heat pipe, and electronic apparatus including loop heat pipe'20148,479,386'Method for manufacturing interposer'20138,474,126'Manufacturing method of semiconductor device'20138,344,386'Laminated thin-film device, manufacturing method thereof, and circuit'20138,330,480'Interconnection card for inspection, manufacture method for interconnection card, and inspection method using interconnection card'20128,264,063'Capacitive element, method of manufacture of the same, and semiconductor device'20128,203,198'Thin film capacitor device used for a decoupling capacitor and having a resistor inside'20128,058,110'Plating method, semiconductor device fabrication method and circuit board fabrication method'20118,035,981'Semiconductor device and manufacturing method of the same'20117,937,830'Interposer and electronic device fabrication method'20117,940,516'Capacitor and electronic substrate including the same'20117,927,998'Plating method, semiconductor device fabrication method and circuit board fabrication method'20117,867,869'Laminated thin-film device, manufacturing method thereof, and circuit'20117,863,524'Interposer and method for manufacturing the same'20117,846,852'Method for manufacturing capacitor embedded in interposer'20107,832,069'Capacitor device and method of manufacturing the same'20107,793,396'Manufacturing method of capacitor'20107,795,739'Semiconductor device, method of manufacturing the same'20107,778,009'Thin-film capacitor and method of manufacturing the same'20107,745,924'Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer'20107,726,198'Strain sensor'20107,670,940'Plating method, semiconductor device fabrication method and circuit board fabrication method'20107,618,859'Thin film capacitor and fabrication method thereof'20097,614,142'Method for fabricating an interposer'20097,557,014'Semiconductor system-in-package'20097,491,996'Capacitive element, semiconductor device, and method of manufacturing the capacitive element'20097,466,152'Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof'20087,456,078'Thin-film capacitor and method for fabricating the same, electronic device and circuit board'20087,439,199'Capacitive element, method of manufacture of the same, and semiconductor device'20087,417,276'Thin film capacitor and fabrication method thereof'20087,405,921'Layer capacitor element and production process as well as electronic device'20087,405,366'Interposer and electronic device fabrication method'20087,365,327'Electromagnetic radiation sensor and method for fabricating the same'20087,355,290'Interposer and method for fabricating the same'20087,349,195'Thin film capacitor and method for manufacturing the same'20087,339,277'Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate'20087,326,989'Thin film capacitor and its manufacture method'20087,298,050'Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same'20077,251,117'Thin film capacitor and method of manufacturing the same'20077,227,736'Capacitor device and method of manufacturing the same'20077,180,119'Capacitor and method for fabricating the same, and semiconductor device and method for fabricating the same'20077,176,556'Semiconductor system-in-package'20077,172,945'Method of manufacturing thin film capacitor'20077,161,200'Capacitive element and method of manufacturing the same'20077,161,793'Layer capacitor element and production process as well as electronic device'20077,102,367'Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof'20067,026,680'Thin film capacitive element, method for producing same and electronic device'20066,975,501'Electronic device and method of applying voltage to capacitor'20056,894,396'Semiconductor device with capacitor'20056,882,516'Thin film capacitor and method of manufacturing the same'20056,873,038'Capacitor and semiconductor device and method for fabricating the semiconductor device'20056,853,051'Thin film capacitor and method of manufacturing the same'20056,803,617'Capacitor and method for fabricating the same'20046,624,501'Capacitor and semiconductor device'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2021Patents assigned to FUJITSU LTD (62)· patent assignee history
2003–2016Based in Kawasaki, JP· patent location history
2010Based in Kanagawa, JP· patent location history
2011–2016Patents assigned to SHIOGA TAKESHI (9)· patent assignee history
2011–2013Patents assigned to KURIHARA KAZUAKI (7)· patent assignee history
2011–2013Patents assigned to BANIECKI JOHN DAVID (3)· patent assignee history
2011–2013Patents assigned to MIZUKOSHI MASATAKA (2)· patent assignee history
2014–2021Based in Atsugi, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FUJITSU LTD622003–2021
SHIOGA TAKESHIself92011–2016
KURIHARA KAZUAKI72011–2013
BANIECKI JOHN DAVID32011–2013
MIZUKOSHI MASATAKA22011–2013
Locations
LocationPatentsSpan
Kawasaki, JP542003–2016
Atsugi, JP82014–2021
Kanagawa, JP12010