Inventor
Wei Han Koo
Inventor
Melaka, MY
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems8%
H02PControl or regulation of electric motors, electric generators or dynamo-electric converters8%
H03KPulse technique8%
PatentTitleYear
11,081,455Semiconductor device with bond pad extensions formed on molded appendage202111,075,185Semiconductor package with multi-level conductive clip for top side cooling202110,978,380Semiconductor package with multi-level conductive clip for top side cooling202110,727,151Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor package202010,396,018Multi-phase half bridge driver package and methods of manufacture2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2021Patents assigned to INFINEON TECHNOLOGIES AG (4)· patent assignee history
2019–2021Based in Melaka, MY· patent location history
2021Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (1)· patent assignee history
2021Based in Taichung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 4 | 2019–2021 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Melaka, MY | 4 | 2019–2021 |
| Taichung, TW | 1 | 2021 |