Inventor
Seiji Katsuoka
Inventor
Tokyo, JP
Overview
Patents· 44 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
B24BMachines, devices, or processes for grinding or polishing23%
C25DProcesses for the electrolytic or electrophoretic production of coatings10%
Y10TTechnical subjects covered by former us classification10%
C23CCoating metallic material8%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests8%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
H01LSemiconductor devices4%
B08BCleaning in general1%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling1%
PatentTitleYear
10,688,620Polishing apparatus202010,486,285Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method20199,687,957'Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method'20179,358,662'Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method'20169,144,881'Polishing apparatus and polishing method'20158,795,032'Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method'20148,777,198'Substrate holding apparatus, substrate holding method, and substrate processing apparatus'20148,257,143'Method and apparatus for polishing object'20128,225,803'Substrate processing method and apparatus'20128,141,513'Substrate holding apparatus, substrate holding method, and substrate processing apparatus'20128,133,376'Substrate holder, plating apparatus, and plating method'20128,038,136'Hand having rocking mechanism and substrate delivering device having the same'20117,976,362'Substrate polishing apparatus and method'20117,959,977'Substrate processing method and apparatus'20117,886,685'Substrate holding apparatus, substrate holding method, and substrate processing apparatus'20117,807,027'Substrate holder, plating apparatus, and plating method'20107,735,451'Substrate processing method and apparatus'20107,735,450'Substrate holding apparatus'20107,585,205'Substrate polishing apparatus and method'20097,575,636'Substrate processing apparatus and substrate processing method'20097,442,257'Substrate processing apparatus and substrate processing method'20087,374,646'Electrolytic processing apparatus and substrate processing method'20087,368,016'Substrate processing unit and substrate processing apparatus'20087,341,634'Apparatus for and method of processing substrate'20087,235,135'Substrate processing apparatus and substrate processing method'20077,101,255'Polishing apparatus'20067,087,117'Substrate processing apparatus and substrate processing method'20066,918,814'Polishing apparatus'20056,844,274'Substrate holder, plating apparatus, and plating method'20056,629,883'Polishing apparatus'20036,435,949'Workpiece polishing apparatus comprising a fluid pressure bag provided between a pressing surface and the workpiece and method of use thereof'20026,413,357'Polishing apparatus'20026,413,146'Polishing apparatus'20026,402,597'Polishing apparatus and method'20026,354,918'Apparatus and method for polishing workpiece'20026,332,826'Polishing apparatus'20016,312,312'Polishing apparatus'20016,293,858'Polishing device'20016,139,677'Polishing apparatus'20005,931,723'Polishing apparatus'19995,860,847'Polishing apparatus'19995,839,947'Polishing apparatus'19985,647,792'Polishing apparatus'19975,643,067'Dressing apparatus and method'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2020Patents assigned to EBARA CORP (44)· patent assignee history
1997–2003Based in Atsugi, JP· patent location history
2001–2020Based in Tokyo, JP· patent location history
2001–2006Based in Kanagawa, JP· patent location history
2012–2014Patents assigned to KATSUOKA SEIJI (6)· patent assignee history
2012–2014Patents assigned to KOBAYASHI KENICHI (4)· patent assignee history
2012–2014Patents assigned to OGAWA TAKAHIRO (4)· patent assignee history
2012–2014Patents assigned to SEKIMOTO MASAHIKO (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 44 | 1997–2020 |
| KATSUOKA SEIJIself | 6 | 2012–2014 |
| KOBAYASHI KENICHI | 4 | 2012–2014 |
| OGAWA TAKAHIRO | 4 | 2012–2014 |
| SEKIMOTO MASAHIKO | 4 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 28 | 2001–2020 |
| Atsugi, JP | 12 | 1997–2003 |
| Kanagawa, JP | 4 | 2001–2006 |