Inventor
Rupert Fischer
Inventor
Maxhuette-Haidhof, DE
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H01LSemiconductor devices10%
PatentTitleYear
9,673,170'Batch process for connecting chips to a carrier'20178,642,408'Semiconductor device'20148,110,906'Semiconductor device including isolation layer'20127,868,465'Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier'20117,727,813'Method for making a device including placing a semiconductor chip on a substrate'20107,667,337'Semiconductor device with conductive die attach material'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010–2017Patents assigned to INFINEON TECHNOLOGIES AG (6)· patent assignee history
2010–2017Based in Maxhuette-Haidhof, DE· patent location history
2010Based in Maxhütte-Haidhof, DE· patent location history
2011Based in Maxhuette-Haldhof, DE· patent location history
2012–2014Patents assigned to ENGL REIMUND (2)· patent assignee history
2012–2014Patents assigned to FISCHER RUPERT (2)· patent assignee history
2012–2014Patents assigned to MAHLER JOACHIM (2)· patent assignee history
2012Patents assigned to DEML GERHARD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 6 | 2010–2017 |
| ENGL REIMUND | 2 | 2012–2014 |
| FISCHER RUPERTself | 2 | 2012–2014 |
| MAHLER JOACHIM | 2 | 2012–2014 |
| DEML GERHARD | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Maxhuette-Haidhof, DE | 4 | 2010–2017 |
| Maxhuette-Haldhof, DE | 1 | 2011 |
| Maxhütte-Haidhof, DE | 1 | 2010 |