Inventor
CHIA-HAN LAI
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10DInorganic electric semiconductor devices27%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
PatentTitleYear
12,482,705Conductive feature formation and structure using bottom-up filling deposition202512,362,198Interface tool and methods of operation202511,929,314Interconnect structures including a fin structure and a metal cap202411,532,503Conductive feature structure including a blocking region202211,444,028Contact structure and formation thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2022–2025 |