Inventor
Chie Iino
Inventor
Ibaraki, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
C09JAdhesives23%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds8%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
PatentTitleYear
10,128,131Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor device201810,074,582Sealing sheet20189,754,894'Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing'20179,659,883'Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2018Patents assigned to NITTO DENKO CORP (4)· patent assignee history
2017–2018Based in Ibaraki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 4 | 2017–2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 4 | 2017–2018 |