Inventor
CHUNG-TI HSU
Inventor
US
Overview
Patents· 1 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H02HEmergency protective circuit arrangements25%
H10DInorganic electric semiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
PatentTitleYear
11,916,026High voltage supply clamp2024Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2024Patents assigned to QUALCOMM INC (1)· patent assignee history
2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 1 | 2024 |