Inventor
Nao Kamakura
Inventor
Ibaraki, JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients13%
C09JAdhesives13%
B22FWorking metallic powder8%
B23KSoldering or unsoldering5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
C08LCompositions of macromolecular compounds3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
PatentTitleYear
10,888,929Sheet and composite sheet202110,821,543Joint manufacturing method202010,748,866Thermal bonding sheet, thermal bonding sheet with dicing tape, bonded body production method, and power semiconductor device202010,707,184Thermal bonding sheet and thermal bonding sheet with dicing tape202010,685,933Thermal bonding sheet and thermal bonding sheet with dicing tape202010,669,452Thermal bonding sheet and thermal bonding sheet with dicing tape202010,301,509Sheet for thermal bonding and sheet for thermal bonding with affixed dicing tape2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2021Patents assigned to NITTO DENKO CORP (7)· patent assignee history
2019–2021Based in Ibaraki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 7 | 2019–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ibaraki, JP | 7 | 2019–2021 |