Inventor
Chung-Shi Liu
Inventor
Hsinchu, TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
B29CShaping or joining of plastics6%
G06FElectric digital data processing6%
H01QAntennas, i.e. radio aerials6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
11,049,832Formation method of package structure with warpage-control element202111,049,850Methods of bonding the strip-shaped under bump metallization structures202111,043,731Package structure202111,043,463Interconnect structures and methods of forming same202111,024,618Wafer-level underfill and over-molding202111,024,594Substrate and package structure20217,558,062'Heat-dissipating module and electronic apparatus'2009Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2009Patents assigned to INVENTEC CORP (1)· patent assignee history
2009Based in Taipei, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2021Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2021 |
| INVENTEC CORP | 1 | 2009 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 6 | 2021 |
| Taipei, TW | 1 | 2009 |