Inventor
Wei-Yan Shih
Inventor
Plano, TX, US
Overview
Patents· 24 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
B81BMicrostructural devices or systems, e.g. micromechanical devices9%
G02BOptical elements, systems or apparatus9%
B29DProducing particular articles from plastics or from substances in a plastic state6%
C03CChemical composition of glasses, glazes or vitreous enamels6%
H01LSemiconductor devices6%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers6%
H10DInorganic electric semiconductor devices6%
Y10TTechnical subjects covered by former us classification6%
B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency, e.g. for performing mechanical work in general4%
PatentTitleYear
10,873,020Piezoelectric sensing apparatus and method202010,399,711Graded carbon-carbon composites with an integral ablative layer and methods for production thereof201910,353,503Integrated force sensing element20199,970,831Piezoelectric thin-film sensor20189,751,108'Extended range ultrasound transducer'20179,679,864'Printed interconnects for semiconductor packages'20179,630,835'Wafer level packaging of MEMS'20179,496,171'Printed interconnects for semiconductor packages'20169,411,159'Low cost window production for hermetically sealed optical packages'20169,050,764'Low cost window production for hermetically sealed optical packages'20158,674,933'Integrated system with computing and imaging capabilities'20148,617,960'Silicon microphone transducer'20138,536,666'Silicon microphone with integrated back side cavity'20138,309,388'MEMS package having formed metal lid'20128,304,846'Silicon microphone with integrated back side cavity'20128,042,248'Low cost window production for hermetically sealed optical packages'20117,786,747'Microdisplay assemblies and methods of packaging microdisplays'20107,106,491'Split beam micromirror'20066,937,382'Active border pixels for digital micromirror device'20056,724,518'Split beam micromirror'20046,573,194'Method of growing surface aluminum nitride on aluminum films with low energy barrier'20036,465,350'Aluminum nitride thin film formation on integrated circuits'20026,329,722'Bonding pads for integrated circuits having copper interconnect metallization'20016,268,662'Wire bonded flip-chip assembly of semiconductor devices'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2020Patents assigned to TEXAS INSTRUMENTS INC (22)· patent assignee history
2001–2020Based in Plano, TX, US· patent location history
2012–2015Patents assigned to SHIH WEI-YAN (5)· patent assignee history
2013Patents assigned to BARRON LANCE W (1)· patent assignee history
2013Patents assigned to DENISON MARIE (1)· patent assignee history
2014Patents assigned to BARKER PAUL GERARD (1)· patent assignee history
2019Based in Yorba Linda, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 22 | 2001–2020 |
| SHIH WEI-YANself | 5 | 2012–2015 |
| BARKER PAUL GERARD | 1 | 2014 |
| BARRON LANCE W | 1 | 2013 |
| DENISON MARIE | 1 | 2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Plano, Texas, US | 23 | 2001–2020 |
| Yorba Linda, California, US | 1 | 2019 |