Inventor
Ruey Kae Zang
Inventor
San Diego, CA, US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H05KPrinted circuits13%
G06FElectric digital data processing7%
H10DInorganic electric semiconductor devices7%
Y10TTechnical subjects covered by former us classification7%
PatentTitleYear
10,321,575Integrated circuit (IC) module comprising an integrated circuit (IC) package and an interposer with embedded passive components201910,231,324Staggered power structure in a power distribution network (PDN)20199,041,176'Hybrid semiconductor module structure'20158,952,552'Semiconductor package assembly systems and methods using DAM and trench structures'20158,890,143'Method to optimize and reduce integrated circuit, package design, and verification cycle time'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2019Patents assigned to QUALCOMM INC (5)· patent assignee history
2014–2015Patents assigned to ZANG RUEY KAE (2)· patent assignee history
2014Patents assigned to LANE RYAN D (1)· patent assignee history
2014–2019Based in San Diego, CA, US· patent location history
2015Patents assigned to HSU WEN-SUNG (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| QUALCOMM INC | 5 | 2014–2019 |
| ZANG RUEY KAEself | 2 | 2014–2015 |
| HSU WEN-SUNG | 1 | 2015 |
| LANE RYAN D | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Diego, California, US | 5 | 2014–2019 |