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Inventor

Hiroyuki Oonishi

Inventor
Ueda, JP

Overview

2→
Patents
2014–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G02Fprimary
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein17%
H01LSemiconductor devices17%
H10DInorganic electric semiconductor devices17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
Y10TTechnical subjects covered by former us classification17%
PatentTitleYear
10,566,196Method for manufacturing bonded SOI wafer20208,699,236'Conductive buffer material and display device'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014Patents assigned to HISAKAWA KOHJI (1)· patent assignee history
2014Patents assigned to OONISHI HIROYUKI (1)· patent assignee history
2014Patents assigned to SHARP KK (1)· patent assignee history
2014Based in Osaka, JP· patent location history
2020Patents assigned to SHINETSU HANDOTAI KK (1)· patent assignee history
2020Based in Ueda, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HISAKAWA KOHJI12014
OONISHI HIROYUKIself12014
SHARP KK12014
SHINETSU HANDOTAI KK12020
Locations
LocationPatentsSpan
Ueda, JP12020
Osaka, JP12014