Inventor
NAOKI SHIBATA
Inventor
JP
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits32%
H01LSemiconductor devices7%
B08BCleaning in general5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G06FElectric digital data processing4%
G11BInformation storage based on relative movement between record carrier and transducer4%
H04LTransmission of digital information, e.g. telegraphic communication4%
H04WWireless communication networks4%
Y02CCapture, storage, sequestration or disposal of greenhouse gases [ghg]4%
PatentTitleYear
12,575,028Wiring circuit board202612,557,214Wiring circuit board2026D1114157Carbon dioxide adsorption device202612,538,431Producing method of wired circuit board202612,532,417Wiring circuit board assembly sheet and method for producing wiring circuit board assembly sheet2026D1099726Carbon dioxide adsorption device202512,453,013Method for producing wiring circuit board and wiring circuit board202512,434,646Moving body setting apparatus, moving body, moving body setting system, method and computer readable storage medium202512,393,121Point-of-use blending of rinse solutions for EUV processing to mitigate pattern collapse202512,382,578Method for manufacturing wiring circuit board202512,369,247Wiring circuit board202512,317,424Wiring circuit board202512,289,830Wiring circuit board and wiring circuit board assembly202512,279,367Wiring circuit board and producing method thereof202512,267,444Blockchain system with improved throughput by splitting blocks, and its computer program202512,207,410Wiring circuit board202512,195,957Cleaning device, cleaning system including same, and cleaning method using said cleaning device202512,167,544Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet202412,167,501Setting apparatus202412,035,484Wiring circuit board202411,843,080Nitride semiconductor light-emitting element202311,762,297Point-of-use blending of rinse solutions to mitigate pattern collapse202311,565,572Device and method of controlling starting of vehicle devices202311,528,803Wiring circuit board assembly sheet, producing method thereof, and producing method of wiring circuit board202211,503,716Wiring circuit board assembly sheet and producing method thereof202211,475,025Blockchain system comprising consensus protocol using search for good approximate solutions to any optimization problem and its computor program202211,452,215Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet202211,284,503Wiring circuit board, producing method thereof, and wiring circuit sheet202211,272,615Wiring circuit board202211,141,758Film forming method, storage medium, and film forming system2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to TOKYO ELECTRON LTD (3)· patent assignee history
2021–2026Based in JP· patent location history
2022–2026Patents assigned to NITTO DENKO CORP (18)· patent assignee history
2022–2025Patents assigned to SHIBATA NAOKI (2)· patent assignee history
2023–2025Patents assigned to HONDA MOTOR CO LTD (3)· patent assignee history
2023–2025Based in US· patent location history
2025–2026Patents assigned to MITSUBISHI HEAVY IND LTD (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NITTO DENKO CORP | 18 | 2022–2026 |
| HONDA MOTOR CO LTD | 3 | 2023–2025 |
| TOKYO ELECTRON LTD | 3 | 2021–2025 |
| MITSUBISHI HEAVY IND LTD | 2 | 2025–2026 |
| SHIBATA NAOKIself | 2 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 28 | 2021–2026 |
| US | 2 | 2023–2025 |