Inventor
Yasuyuki Sanda
Inventor
Tokyo, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G01Nprimary
G01NInvestigating or analysing materials by determining their chemical or physical properties33%
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
11,107,745Semiconductor device and method for manufacturing the same202111,049,787Semiconductor device and method of manufacturing the same202110,775,329Thermal conductivity measurement device and thermal conductivity measurement method202010,768,127Thermal conductivity measurement apparatus and thermal conductivity measurement method20209,892,992'Swaged heat sink and heat sink integrated power module'2018Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2018–2021Patents assigned to MITSUBISHI ELECTRIC CORP (4)· patent assignee history
2018Based in Chiyoda-ku, JP· patent location history
2020–2021Based in Tokyo, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 4 | 2018–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 4 | 2020–2021 |
| Chiyoda-ku, JP | 1 | 2018 |