Inventor
Yang-chun CHENG
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
C09GPolishing compositions15%
H10DInorganic electric semiconductor devices15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
C09KMaterials for miscellaneous applications, not provided for elsewhere7%
B24BMachines, devices, or processes for grinding or polishing4%
B82YSpecific uses or applications of nanostructures4%
H05BElectric heating4%
PatentTitleYear
12,550,695Methods of forming an abrasive slurry and methods for chemical-mechanical polishing202612,426,307Dual metal gate structures on nanoribbon semiconductor devices202512,315,805Self-aligned lateral contacts202512,224,179Metal heterojunction structure with capping metal layer202511,633,829External heating system for use in chemical mechanical polishing system202311,637,021Metal heterojunction structure with capping metal layer202311,482,450Methods of forming an abrasive slurry and methods for chemical- mechanical polishing2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2022–2025Based in TW· patent location history
2025Patents assigned to INTEL CORP (2)· patent assignee history
2025–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2022–2026 |
| INTEL CORP | 2 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 4 | 2022–2025 |
| US | 3 | 2025–2026 |