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Inventor

Yasuhiro Horiike

Inventor
Tokyo, JP

Overview

45→
Patents
1977–2011
Patent span
Electricity
Primary field (CPC H)

Patents· 45 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
H01JElectric discharge tubes or discharge lamps21%
C23CCoating metallic material8%
C23FNon-mechanical removal of metallic material from surface6%
B01LChemical or physical laboratory apparatus for general use4%
B23KSoldering or unsoldering3%
B01JChemical or physical processes, e.g. catalysis or colloid chemistry2%
B24BMachines, devices, or processes for grinding or polishing2%
C12NMicroorganisms or enzymes2%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
PatentTitleYear
7,972,577'Chip using method and test chip'20117,691,369'Cultured cell construct which contains spheroids of cultured animal cells and the use thereof'20107,691,328'Chip using method and test chip'20107,678,577'Blood analysis apparatus and blood analysis method'20107,582,259'Blood analysis device and blood analysis method'20097,470,424'Cultured cell construct containing spheroids of cultured animal cells and utilization thereof'20086,496,748'Wafer flattening process and storage medium'20026,461,533'Etchant for silicon oxide and method'20026,451,217'Wafer etching method'20026,360,687'Wafer flattening system'20026,316,369'Corrosion-resistant system and method for a plasma etching apparatus'20016,280,645'Wafer flattening process and system'20016,254,718'Combined CMP and plasma etching wafer flattening system'20016,159,388'Plasma etching method and plasma etching system for carrying out the same'20006,155,200'ECR plasma generator and an ECR system using the generator'20006,096,176'Sputtering method and a sputtering apparatus thereof'20005,997,700'Method of fabricating magnetic head slider'19995,855,728'Method for cleaning vulcanization mold'19995,851,600'Plasma process method and apparatus'19985,487,785'Plasma treatment apparatus'19965,308,791'Method and apparatus for processing surface of semiconductor layer'19945,290,609'Method of forming dielectric film for semiconductor devices'19945,185,132'Atomspheric plasma reaction method and apparatus therefor'19935,112,645'Phototreating method and apparatus therefor'19924,878,995'Method of dry etching and apparatus for use in such method'19894,844,774'Phototreating method and apparatus therefor'19894,838,978'Dry etching apparatus'19894,786,361'Dry etching process'19884,698,238'Pattern-forming method'19874,668,337'Dry-etching method and apparatus therefor'19874,642,171'Phototreating apparatus'19874,529,475'Dry etching apparatus and method using reactive gases'19854,526,643'Dry etching apparatus using reactive ions'19854,492,610'Dry Etching method and device therefor'19854,431,473'RIE Apparatus utilizing a shielded magnetron to enhance etching'19844,341,593'Plasma etching method for aluminum-based films'19824,277,304'Ion source and ion etching process'19814,252,595'Etching apparatus using a plasma'19814,192,706'Gas-etching device'19804,175,235'Apparatus for the plasma treatment of semiconductors'19794,160,690'Gas etching method and apparatus'19794,151,034'Continuous gas plasma etching apparatus'19794,123,663'Gas-etching device'19784,094,722'Etching apparatus using a plasma'19784,065,369'Activated gas reaction apparatus & method'1977

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1977–1985Patents assigned to TOKYO SHIBAURA ELECTRIC CO (12)· patent assignee history
1978–2011Based in Tokyo, JP· patent location history
1985–1992Patents assigned to TOSHIBA KK (9)· patent assignee history
1993–1996Based in Hiroshima, JP· patent location history
1994–2002Patents assigned to HORIIKE YASUHIRO (6)· patent assignee history
1994–2000Patents assigned to TOKYO ELECTRON LTD (6)· patent assignee history
1999–2001Based in Houya, JP· patent location history
2000–2002Patents assigned to SPEEDFAM CO LTD (4)· patent assignee history
2008–2010Based in Nishitokyo, JP· patent location history
2010Based in Ibaraki, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TOKYO SHIBAURA ELECTRIC CO121977–1985
TOSHIBA KK91985–1992
HORIIKE YASUHIROself61994–2002
TOKYO ELECTRON LTD61994–2000
SPEEDFAM CO LTD42000–2002
Locations
LocationPatentsSpan
Tokyo, JP281978–2011
Houya, JP51999–2001
Nishitokyo, JP32008–2010
Hiroshima, JP31993–1996
Ibaraki, JP12010