Inventor

Tomiho Yamada

Inventor

Ohbu, JP

Overview

2002–2021

Patent span

Performing operations

Primary field (CPC B)

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary

B24BMachines, devices, or processes for grinding or polishing13%

B24DTools for grinding, buffing or sharpening13%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients13%

H05KPrinted circuits13%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form6%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds6%

C08JWorking-up6%

C08LCompositions of macromolecular compounds6%

G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure6%

H01BCables6%

PatentTitleYear

Assembled from patent assignee/location history and declaration credentials.

2002–2010Patents assigned to NOF CORP (2)· patent assignee history

2002Patents assigned to TDK CORP (1)· patent assignee history

2002Based in Obun, JP· patent location history

2007–2011Patents assigned to TOSHIBA KK (2)· patent assignee history

2007–2011Based in Ohbu, JP· patent location history

2010Based in Aichi, JP· patent location history

2021Patents assigned to MIKUNI KOGYO KK (1)· patent assignee history

2021Based in Seto, JP· patent location history

Assignee and location history derived from the patent record.

Assignees

Locations