Inventor
Jun Mo Koo
Inventor
Singapore, SG
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H04BTransmission7%
H04NPictorial communication, e.g. television4%
G02BOptical elements, systems or apparatus3%
H05KPrinted circuits3%
H10DInorganic electric semiconductor devices3%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them1%
G05BControl or regulating systems in general1%
PatentTitleYear
10,242,948Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package20199,875,911Semiconductor device and method of forming interposer with opening to contain semiconductor die20189,679,824'Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP'20179,620,455'Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure'20179,559,039'Semiconductor device and method of using substrate having base and conductive posts to form vertical interconnect structure in embedded die package'20179,437,538'Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect'20169,337,116'Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die'20169,318,441'Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die'20169,305,854'Semiconductor device and method of forming RDL using UV-cured conductive ink over wafer level package'20169,263,301'Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die'20169,224,647'Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposer'20159,142,515'Semiconductor device with protective layer over exposed surfaces of semiconductor die'20158,999,760'Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure'20158,993,377'Semiconductor device and method of bonding different size semiconductor die at the wafer level'20158,866,294'Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation'20148,796,137'Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect'20148,642,381'Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die'20148,435,834'Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP'20138,288,201'Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die'20128,241,964'Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation'20128,236,617'Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure'20128,009,971'Hand-shake correction method and apparatus of camera module for use in mobile device'20117,979,143'Apparatus and method for proportional-integral-derivative control'20117,489,340'Optical image stabilizer for camera lens assembly'20097,254,122'Apparatus and method for generating pilot beacon signal in base stations of CDMA system'20077,215,884'Optical demultiplexer having bragg diffration grating and optical communication module using the optical demultiplexer'20076,516,007'Method for synchronizing reverse link and transmission method using synchronous reverse link'20036,009,074'CDMA modulation and demodulation method reducing interference and a communication system using the same'19995,956,367'Rake receiving apparatus for direct sequence code division multiple access system'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999Based in Seoul, KR· patent location history
2003–2007Based in Taejeon, KR· patent location history
2007–2011Based in Suwon-si, KR· patent location history
2012–2017Patents assigned to STATS CHIPPAC LTD (17)· patent assignee history
2012–2018Patents assigned to KOO JUN MO (15)· patent assignee history
2012–2018Patents assigned to PAGAILA REZA A (13)· patent assignee history
2012–2018Patents assigned to LIN YAOJIAN (11)· patent assignee history
2012–2019Based in Singapore, SG· patent location history
2016–2019Patents assigned to STATS CHIPPAC PTE LTD (6)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| STATS CHIPPAC LTD | 17 | 2012–2017 |
| KOO JUN MOself | 15 | 2012–2018 |
| PAGAILA REZA A | 13 | 2012–2018 |
| LIN YAOJIAN | 11 | 2012–2018 |
| STATS CHIPPAC PTE LTD | 6 | 2016–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Singapore, SG | 21 | 2012–2019 |
| Suwon-si, KR | 4 | 2007–2011 |
| Taejeon, KR | 2 | 2003–2007 |
| Seoul, KR | 2 | 1999 |