Inventor
Taichi Yamada
Inventor
JP
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics25%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering25%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts13%
D01DMechanical methods or apparatus in the manufacture of artificial filaments, threads, fibres, bristles or ribbons8%
D01FChemical features in the manufacture of artificial filaments, threads, fibres, bristles or ribbons8%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling4%
B29BPreparation or pretreatment of the material to be shaped4%
H01PWaveguides4%
H05KPrinted circuits4%
Y10TTechnical subjects covered by former us classification4%
PatentTitleYear
11,738,502Filament for three-dimensional modeling202311,697,253Impregnation device and shaping apparatus202311,518,108Manufacturing apparatus202211,491,719Shaping apparatus202211,413,810Filament for three-dimensional modeling, three-dimensional modeled article, three-dimensional modeling method, and three-dimensional modeling apparatus202211,318,638Forming-material connecting device and forming apparatus202211,217,871Distributor and synthesizer2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2023Patents assigned to FUJIFILM BUSINESS INNOVATION CORP (6)· patent assignee history
2022Patents assigned to SONY SEMICONDUCTOR SOLUTIONS CORP (1)· patent assignee history
2022–2023Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJIFILM BUSINESS INNOVATION CORP | 6 | 2022–2023 |
| SONY SEMICONDUCTOR SOLUTIONS CORP | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 7 | 2022–2023 |