Inventor

Pei Sian Shao

Inventor

Taoyuan, TW

Overview

1→

Patents

2021

Patent span

Performing operations

Primary field (CPC B)

Patents· 1 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary

B29CShaping or joining of plastics17%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts17%

B29LIndexing scheme associated with subclass b29c, relating to particular articles17%

H01LSemiconductor devices17%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1017%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%

PatentTitleYear

11,004,828Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021Patents assigned to MICRON TECHNOLOGY INC (1)· patent assignee history

2021Based in Taoyuan, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MICRON TECHNOLOGY INC	1	2021

Locations

Location	Patents	Span
Taoyuan, TW	1	2021