Inventor
Jerry Tzou
Inventor
Hsinchu, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1083%
H10DInorganic electric semiconductor devices17%
PatentTitleYear
8,704,383'Silicon-based thin substrate and packaging schemes'20148,174,129'Silicon-based thin substrate and packaging schemes'20127,851,331'Bonding structures and methods of forming bonding structures'20107,804,177'Silicon-based thin substrate and packaging schemes'20107,446,424'Interconnect structure for semiconductor package'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2014Patents assigned to TAIWAN SEMICONDUCTOR MFG (5)· patent assignee history
2008–2014Based in Hsinchu, TW· patent location history
2012–2014Patents assigned to CHANG KUO-CHIN (2)· patent assignee history
2012–2014Patents assigned to CHAO CLINTON (2)· patent assignee history
2012–2014Patents assigned to KARTA TJANDRA WINATA (2)· patent assignee history
2012–2014Patents assigned to LUH ANN (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG | 5 | 2008–2014 |
| CHANG KUO-CHIN | 2 | 2012–2014 |
| CHAO CLINTON | 2 | 2012–2014 |
| KARTA TJANDRA WINATA | 2 | 2012–2014 |
| LUH ANN | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 2008–2014 |