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Inventor

Darryl J. McKenney

Inventor
Londonderry, NH, US

Overview

16→
Patents
1989–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 16 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits33%
Y10TTechnical subjects covered by former us classification19%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%
H01RElectrically-conductive connections9%
B05DProcesses for applying fluent materials to surfaces, in general5%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form5%
G06FElectric digital data processing5%
Y02PClimate change mitigation technologies in the production or processing of goods5%
B23CMilling2%
C23CCoating metallic material2%
PatentTitleYear
10,096,915Soldered interconnect for a printed circuit board having an angular radial feature20189,761,972'Radio frequency connector and assembly having micro-via radial interconnect'20179,389,654'Air-flow-by cooling technology and air-flow-by circuit board modules'20169,128,679'Slot and memory module for a slot standing interconnect'20159,033,750'Electrical contact'20156,689,958'Controlled impedance extruded flat ribbon cable'20046,645,549'Process for providing bond enhancement and an etch resist in the fabrication of printed circuit boards'20036,099,745'Rigid/flex printed circuit board and manufacturing method therefor'20005,557,843'Method of making a circuit board or layer thereof including semi-curing a second adhesive coated on a cured first adhesive'19965,376,232'Method of manufacturing a printed circuit board'19945,362,534'Multiple layer printed circuit boards and method of manufacture'19945,262,594'Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same'19935,178,318'Multilayer rigid-flex printed circuit boards for use in infrared reflow oven and method for assembling same'19935,175,047'Rigid-flex printed circuit'19925,095,628'Process of forming a rigid-flex circuit'19924,800,461'Multilayer combined rigid and flex printed circuits'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–1993Patents assigned to TELEDYNE IND (4)· patent assignee history
1989–1996Based in Milford, NH, US· patent location history
1993Patents assigned to COMPAQ COMPUTER CORP (2)· patent assignee history
1994–2004Patents assigned to PARLEX CORP (6)· patent assignee history
2000–2018Based in Londonderry, NH, US· patent location history
2015–2018Patents assigned to MERCURY SYSTEMS INC (4)· patent assignee history
2015–2016Patents assigned to MERCURY COMP SYSTEMS INC (2)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
PARLEX CORP61994–2004
MERCURY SYSTEMS INC42015–2018
TELEDYNE IND41989–1993
COMPAQ COMPUTER CORP21993
MERCURY COMP SYSTEMS INC22015–2016
Locations
LocationPatentsSpan
Londonderry, NH, US82000–2018
Milford, NH, US81989–1996