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Inventor

Yuichi Takakura

Inventor
Osaka, JP

Overview

3→
Patents
2000–2011
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits29%
B23KSoldering or unsoldering14%
B65GTransport or storage devices, e.g. conveyors for loading or tipping, shop conveyor systems or pneumatic tube conveyors14%
B65HHandling thin or filamentary material, e.g. sheets, webs, cables14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
8,062,450'Tape splicing apparatus and attaching apparatus'20116,692,214'Pusher, puller loader, unloader, and working device'20046,098,868'Bump forming method and bump bonder'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2004Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (2)· patent assignee history
2000Based in Hirakata, JP· patent location history
2004–2011Based in Osaka, JP· patent location history
2011Patents assigned to IDA MASAYUKI (1)· patent assignee history
2011Patents assigned to KATANO RYOUICHIROU (1)· patent assignee history
2011Patents assigned to ODAWARA KOZO (1)· patent assignee history
2011Patents assigned to PANASONIC CORP (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD22000–2004
IDA MASAYUKI12011
KATANO RYOUICHIROU12011
ODAWARA KOZO12011
PANASONIC CORP12011
Locations
LocationPatentsSpan
Osaka, JP22004–2011
Hirakata, JP12000