Inventor
Donna J. Trevitt
Inventor
Vestal, NY, US
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material25%
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
C08JWorking-up13%
Y10TTechnical subjects covered by former us classification13%
PatentTitleYear
6,226,187'Integrated circuit package'20016,084,299'Integrated circuit package including a heat sink and an adhesive'20006,046,500'Method of controlling the spread of an adhesive on a circuitized organic substrate'20005,910,341'Method of controlling the spread of an adhesive on a circuitized organic substrate'19994,654,126'Process for determining the plating activity of an electroless plating bath'19874,554,182'Method for conditioning a surface of a dielectric substrate for electroless plating'19854,534,797'Method for providing an electroless copper plating bath in the take mode'19854,448,804'Method for selective electroless plating of copper onto a non-conductive substrate surface'1984Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1984–2001Patents assigned to IBM (8)· patent assignee history
1984–2001Based in Vestal, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 8 | 1984–2001 |
Locations
| Location | Patents | Span |
|---|---|---|
| Vestal, New York, US | 8 | 1984–2001 |