Inventor
Hajime Yazu
Inventor
Ogaki, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits35%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1035%
Y10TTechnical subjects covered by former us classification29%
PatentTitleYear
8,536,696'Conductive pin attached to package substrate'20138,110,917'Package substrate with a conductive connecting pin'20128,035,214'Conductive connecting pin for package substance'20117,902,659'Conductive connecting pin and package substrate'20117,847,393'Conductive connecting pins for a package substrate'20105,124,884'Electronic part mounting board and method of manufacturing the same'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2013Patents assigned to IBIDEN CO LTD (6)· patent assignee history
1992Based in Gifu, JP· patent location history
2010–2013Based in Ogaki, JP· patent location history
2012–2013Patents assigned to HIROSE NAOHIRO (2)· patent assignee history
2012–2013Patents assigned to ITO HITOSHI (2)· patent assignee history
2012–2013Patents assigned to IWATA YOSHIYUKI (2)· patent assignee history
2012–2013Patents assigned to KAWADE MASANORI (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBIDEN CO LTD | 6 | 1992–2013 |
| HIROSE NAOHIRO | 2 | 2012–2013 |
| ITO HITOSHI | 2 | 2012–2013 |
| IWATA YOSHIYUKI | 2 | 2012–2013 |
| KAWADE MASANORI | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ogaki, JP | 5 | 2010–2013 |
| Gifu, JP | 1 | 1992 |