Inventor
Koki Hirasawa
Inventor
Kawasaki, JP
Overview
Patents· 28 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1032%
H01LSemiconductor devices9%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
H05KPrinted circuits8%
H10HInorganic light-emitting semiconductor devices having potential barriers7%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
Y10TTechnical subjects covered by former us classification7%
B29CShaping or joining of plastics5%
A43BCharacteristic features of footwear2%
A47LDomestic washing or cleaning2%
PatentTitleYear
10,714,460Light emitting device and manufacturing method thereof202010,629,786Light emitting device and manufacturing method thereof202010,559,722Light-emitting device202010,267,489Light-emitting apparatus201910,181,553Semiconductor device and method for producing the same201910,158,056LED package, light emitting device and method for manufacturing LED package20189,327,457'Electronic device and method for manufacturing electronic device'20168,986,588'Electronic device and process for manufacturing electronic device'20158,270,177'Electronic device and method for manufacturing electronic device'20128,252,408'Electronic device and method of manufacturing the electronic device'20128,243,461'Electronic device and process for manufacturing electronic device'20128,230,591'Method for fabricating an electronic device substrate'20128,230,588'Method of making an electronic device and electronic device substrate'20128,101,864'Electronic device substrate and its fabrication method, and electronic device and its fabrication method'20127,998,781'Method of manufacturing semiconductor device in which functional portion of element is exposed'20117,939,935'Electronic device substrate, electronic device and methods for fabricating the same'20117,880,091'Electronic device substrate, electronic device and methods for making same'20117,880,279'Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same'20117,705,245'Electronic device substrate and its fabrication method, and electronic device and its fabrication method'20107,291,905'Lead frame, semiconductor device produced by using the same and method of producing the semiconductor device'20077,236,373'Electronic device capable of preventing electromagnetic wave from being radiated'20076,829,266'Optical semiconductor device increasing productivity and method of fabricating the same'20046,555,763'Multilayered circuit board for semiconductor chip module, and method of manufacturing the same'20036,548,880'Optical semiconductor device and a method of manufacturing the same'20036,429,043'Semiconductor circuitry device and method for manufacturing the same'20026,351,026'Multilayered wiring structure and method of manufacturing the same'20026,340,839'Hybrid integrated circuit'20026,274,404'Multilayered wiring structure and method of manufacturing the same'2001Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2001–2007Based in Tokyo, JP· patent location history
2004–2016Based in Kanagawa, JP· patent location history
2007–2012Patents assigned to HITACHI CABLE (7)· patent assignee history
2007–2012Based in Kawasaki, JP· patent location history
2011–2016Patents assigned to RENESAS ELECTRONICS CORP (12)· patent assignee history
2012–2016Patents assigned to HIRASAWA KOKI (8)· patent assignee history
2012–2016Patents assigned to UCHIDA KENJI (8)· patent assignee history
2018–2020Patents assigned to CITIZEN ELECTRONICS (6)· patent assignee history
2018–2020Based in Yamanashi, JP· patent location history
2020Based in Ootsuki, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RENESAS ELECTRONICS CORP | 12 | 2011–2016 |
| HIRASAWA KOKIself | 8 | 2012–2016 |
| UCHIDA KENJI | 8 | 2012–2016 |
| HITACHI CABLE | 7 | 2007–2012 |
| CITIZEN ELECTRONICS | 6 | 2018–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 9 | 2007–2012 |
| Tokyo, JP | 7 | 2001–2007 |
| Kanagawa, JP | 6 | 2004–2016 |
| Yamanashi, JP | 3 | 2018–2020 |
| Ootsuki, JP | 1 | 2020 |