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Inventor

Stefan Rongen

Inventor
Dresden, DE

Overview

3→
Patents
2004–2018
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Bprimary
H10BElectronic memory devices29%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1029%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices14%
H01LSemiconductor devices14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
PatentTitleYear
10,115,621Method for in-die overlay control using FEOL dummy fill layer20186,939,805'Method of etching a layer in a trench and method of fabricating a trench capacitor'20056,828,192'Semiconductor memory cell and method for fabricating the memory cell'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2005Patents assigned to INFINEON TECHNOLOGIES AG (2)· patent assignee history
2004–2005Based in Dresden, DE· patent location history
2018Patents assigned to GLOBALFOUNDRIES INC (1)· patent assignee history
2018Based in Radeburg, DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INFINEON TECHNOLOGIES AG22004–2005
GLOBALFOUNDRIES INC12018
Locations
LocationPatentsSpan
Dresden, DE22004–2005
Radeburg, DE12018