Inventor
Yoshihiko Yamaguchi
Inventor
Iide, JP
Overview
Patents· 29 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems15%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H01FMagnets8%
G05FSystems for regulating electric or magnetic variables5%
Y10TTechnical subjects covered by former us classification5%
F16CShafts3%
G01DMeasuring not specially adapted for a specific variable3%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock3%
H01LSemiconductor devices3%
PatentTitleYear
10,643,783Transformer and DC-DC converter202010,530,172Power storage control apparatus, direct-current power system, and controlling method thereof202010,355,492Rechargeable battery controller201910,230,306Bidirectional DC/DC converter201910,008,938Power conversion device20189,847,723Power conversion device20179,837,908Power conversion device20179,805,980'Method of manufacturing a semiconductor device'20178,877,613'Method of manufacturing a semiconductor device'20148,828,178'Sealing device'20148,049,645'Cylindrical cover-attached encoder apparatus'20117,985,625'Method of manufacturing a semiconductor device'20117,816,185'Method of manufacturing a semiconductor device'20107,579,216'Method of manufacturing a semiconductor device'20097,534,657'Method of manufacturing a semiconductor device'20097,384,820'Method of manufacturing a semiconductor device'20087,081,374'Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it'20067,033,857'Method of manufacturing a semiconductor device'20066,897,097'Semiconductor device and a method of manufacturing the same'20056,689,297'Method of manufacturing magnetic rubber ring'20046,667,193'Semiconductor device and a method of manufacturing the same'20036,602,571'Method for manufacturing magnetic encoders and magnetic encoders manufactured by using such method'20036,592,959'Encoder made of rubber material and method of manufacturing thereof'20036,590,276'Semiconductor device and a method of manufacturing the same'20036,463,667'Machine tool precision-measuring apparatus'20026,399,423'Semiconductor device an a method of manufacturing the same'20025,694,030'Magnetic element for power supply and DC-to-DC converter'19975,583,424'Magnetic element for power supply and dc-to-dc converter'19965,530,218'Spot welding apparatus'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–1997Based in Urawa, JP· patent location history
2002–2005Patents assigned to HITACHI YONEZAWA ELECTRONICS (4)· patent assignee history
2002–2017Based in Iide, JP· patent location history
2003–2014Patents assigned to UCHIYAMA MFG (5)· patent assignee history
2003–2014Based in Okayama, JP· patent location history
2006–2010Patents assigned to RENESAS NTHN JP SEMICONDUCTOR (5)· patent assignee history
2008Based in lide, JP· patent location history
2010–2017Patents assigned to RENESAS ELECTRONICS CORP (4)· patent assignee history
2017–2020Patents assigned to OMRON TATEISI ELECTRONICS CO (7)· patent assignee history
2017–2020Based in Kyoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| OMRON TATEISI ELECTRONICS CO | 7 | 2017–2020 |
| RENESAS NTHN JP SEMICONDUCTOR | 5 | 2006–2010 |
| UCHIYAMA MFG | 5 | 2003–2014 |
| HITACHI YONEZAWA ELECTRONICS | 4 | 2002–2005 |
| RENESAS ELECTRONICS CORP | 4 | 2010–2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Iide, JP | 12 | 2002–2017 |
| Kyoto, JP | 7 | 2017–2020 |
| Okayama, JP | 5 | 2003–2014 |
| Urawa, JP | 2 | 1996–1997 |
| lide, JP | 1 | 2008 |