Inventor
Shinitsu Takehashi
Inventor
Osaka, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1083%
B23KSoldering or unsoldering17%
PatentTitleYear
5,930,599'Semiconductor device and method of manufacturing the same'19995,783,463'Semiconductor device and method of producing said semiconductor device'19985,773,896'Semiconductor device having offsetchips'19985,640,044'Semiconductor device and method of producing said semiconductor device'19975,316,204'Method for bonding lead with electrode of electronic device'1994Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–1999Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (5)· patent assignee history
1994Based in Shijonawate, JP· patent location history
1997–1999Based in Osaka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 5 | 1994–1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Osaka, JP | 4 | 1997–1999 |
| Shijonawate, JP | 1 | 1994 |