Inventor
Milnes P. David
Inventor
Fishkill, NY, US
Overview
Patents· 145 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits29%
Y10TTechnical subjects covered by former us classification10%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application8%
G06FElectric digital data processing7%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h105%
B23PMetal-working not otherwise provided for4%
F25BRefrigeration machines, plants or systems4%
G05DSystems for controlling or regulating non-electric variables3%
H01LSemiconductor devices3%
PatentTitleYear
11,049,052Automated managing of a data center installation202111,019,755Effectiveness-weighted control of cooling system components202110,753,236Fuel vaporization using data center waste heat202010,734,307Composite heat sink structures202010,694,644Thermoelectric-enhanced, inlet air-cooled thermal conductors202010,671,137Acclimation sensing and control of electronic equipment202010,662,961Pump with integrated bypass mechanism202010,664,032Acclimation sensing and control of electronic equipment202010,595,447Effectiveness-weighted control of cooling system components202010,571,342Acclimation process202010,548,241Two-phase cooling with ambient cooled condensor202010,544,707Fuel vaporization using data center waste heat202010,299,409Protective louver assembly for air-moving assembly201910,287,925Fuel vaporization using data center waste heat201910,271,459Protective cover assembly for air-moving assembly201910,265,812Liquid-cooled, composite heat sink assemblies201910,257,599Slack and strain control mechanism201910,247,489Structural dynamic heat sink201910,249,555Composite heat sink structures201910,244,665Effectiveness-weighted control of cooling system components201910,238,009Coolant and ambient temperature control for chillerless liquid cooled data centers201910,231,357Two-phase cooling with ambient cooled condensor201910,169,624Tamper-proof electronic packages with two-phase dielectric fluid201910,160,072Liquid-cooled, composite heat sink assemblies201810,082,048Fuel vaporization using data center waste heat201810,070,560Drawer-level immersion-cooling with hinged, liquid-cooled heat sink201810,048,733Acclimation sensing and control of electronic equipment20189,968,006Locking louver assembly for air-moving assembly20189,951,785Air-moving assemblies with flywheels20189,949,412Thermoelectric-enhanced, inlet air-cooled thermal conductors20189,904,811'Tamper-proof electronic packages with two-phase dielectric fluid'20189,907,211'Locking louver assembly for air-moving assembly'20189,879,926'Controlled cooling of an electronic system for reduced energy consumption'20189,865,522'Composite heat sink structures'20189,861,010'Protective louver assembly for air-moving assembly'20189,795,055'Electronics cooling assembly with multi-position, airflow-blocking mechanism'20179,761,508'Composite heat sink structures'20179,763,357'Fabricating a liquid-cooling apparatus with coolant filter'20179,750,159'Pump-enhanced, immersion-cooling of electronic compnent(s)'20179,750,165'Coolant and ambient temperature control for chillerless liquid cooled data centers'20179,742,182'Acclimation sensing and control of electronic equipment'20179,687,943'Heat sink structure with a vapor-permeable membrane for two-phase cooling'20179,686,889'Field-replaceable bank of immersion-cooled electronic components'20179,686,891'Thermoelectric-enhanced, inlet air cooling for an electronics rack'20179,648,786'Interlock assembly for air-moving assembly'20179,644,907'Structurally dynamic heat sink'20179,629,284'Interlock assembly for air-moving assembly'20179,629,286'Thermoelectric-enhanced, inlet air cooling for an electronics rack'20179,625,220'Structurally dynamic heat sink'20179,623,520'Heat sink structure with a vapor-permeable membrane for two-phase cooling'20179,622,379'Drawer-level immersion-cooling with hinged, liquid-cooled heat sink'20179,568,011'Air-moving assemblies with flywheels'20179,546,576'Fuel vaporization using data center waste heat'20179,546,575'Fuel vaporization using data center waste heat'20179,504,188'Air-moving assembly with auxiliary turbine drive'20169,504,189'Thermoelectric-enhanced, inlet air-cooled thermal conductors'20169,470,439'Contaminant separator for a vapor-compression refrigeration apparatus'20169,474,186'Direct facility coolant cooling of a rack-mounted heat exchanger'20169,464,634'Air-moving assemblies with flywheels'20169,462,729'Tile assemblies faciliating failover airflow into cold air containment aisle'20169,446,487'Heat sink structure with a vapor-permeable membrane for two-phase cooling'20169,439,325'Coolant-cooled heat sink configured for accelerating coolant flow'20169,420,721'Liquid-cooled heat sink assemblies'20169,414,525'Coolant-cooled heat sink configured for accelerating coolant flow'20169,410,751'Controlled cooling of an electronic system for reduced energy consumption'20169,363,924'Ground-based heat sink facilitating electronic system cooling'20169,357,674'Liquid-cooling apparatus with integrated coolant filter'20169,357,682'Cooling method with automated seasonal freeze protection'20169,357,675'Pump-enhanced, immersion-cooling of electronic component(s)'20169,351,431'Cooling system with automated seasonal freeze protection'20169,345,169'Liquid-cooled heat sink assemblies'20169,342,079'Controlled cooling of an electronic system based on projected conditions'20169,332,674'Field-replaceable bank of immersion-cooled electronic components'20169,313,920'Direct coolant contact vapor condensing'20169,295,181'Coolant-conditioning unit with automated control of coolant flow valves'20169,291,281'Thermostat-controlled coolant flow within a heat sink'20169,285,050'Thermostat-controlled coolant flow within a heat sink'20169,288,932'Ground-based heat sink facilitating electronic system cooling'20169,282,675'Thermal expansion-enhanced heat sink for an electronic assembly'20169,282,678'Field-replaceable bank of immersion-cooled electronic components and separable heat sinks'20169,261,308'Pump-enhanced, sub-cooling of immersion-cooling fluid'20169,253,921'Coolant-conditioning unit with automated control of coolant flow valves'20169,250,024'Pump-enhanced, sub-cooling of immersion-cooling fluid'20169,250,636'Coolant and ambient temperature control for chillerless liquid cooled data centers'20169,218,008'Effectiveness-weighted control of cooling system components'20159,213,343'Effectiveness-weighted control method for a cooling system'20159,207,002'Contaminant separator for a vapor-compression refrigeration apparatus'20159,210,830'Immersion-cooled and conduction-cooled method for electronic system'20159,201,474'Valve controlled, node-level vapor condensation for two-phase heat sink(s)'20159,167,721'Direct facility coolant cooling of a rack-mounted heat exchanger'20159,148,982'Separate control of coolant flow through coolant circuits'20159,148,983'Separate control of coolant flow through coolant circuits'20159,113,581'Valve controlled, node-level vapor condensation for two-phase heat sink(s)'20159,110,476'Controlled cooling of an electronic system based on projected conditions'20159,102,021'Heat sink structure with a vapor-permeable membrane for two-phase cooling'20159,095,889'Thermoelectric-enhanced air and liquid cooling of an electronic system'20159,101,078'Data center cooling with an air-side economizer and liquid-cooled electronics rack(s)'20159,095,942'Wicking and coupling element(s) facilitating evaporative cooling of component(s)'20159,089,936'Heat sink structure with a vapor-permeable membrane for two-phase cooling'20159,075,582'Valve controlled, node-level vapor condensation for two-phase heat sink(s)'20159,078,379'Flow boiling heat sink with vapor venting and condensing'20159,067,288'Heat sink structure with a vapor-permeable membrane for two-phase cooling'20159,069,532'Valve controlled, node-level vapor condensation for two-phase heat sink(s)'20159,061,383'Heat sink structure with a vapor-permeable membrane for two-phase cooling'20159,061,382'Heat sink structure with a vapor-permeable membrane for two-phase cooling'20159,052,722'Dynamically limiting energy consumed by cooling apparatus'20159,043,035'Dynamically limiting energy consumed by cooling apparatus'20159,042,098'Air-cooling and vapor-condensing door assembly'20159,042,099'Air-cooling and vapor-condensing door assembly'20159,025,331'Inlet-air-cooling door assembly for an electronics rack'20159,025,332'Inlet-air-cooling door assembly for an electronics rack'20159,013,872'Dry-cooling unit with gravity-assisted coolant flow'20159,009,968'Coolant manifold with separately rotatable manifold section(s)'20159,009,971'Wicking and coupling element(s) facilitating evaporative cooling of component(s)'20158,985,847'Thermal resistance-based monitoring of cooling of an electronic component'20158,966,922'Air-side economizer facilitating liquid-based cooling of an electronics rack'20158,959,941'Data center cooling with an air-side economizer and liquid-cooled electronics rack(s)'20158,964,391'Sectioned manifolds facilitating pumped immersion-cooling of electronic components'20158,964,390'Sectioned manifolds facilitating pumped immersion-cooling of electronic components'20158,955,347'Air-side economizer facilitating liquid-based cooling of an electronics rack'20158,953,317'Wicking vapor-condenser facilitating immersion-cooling of electronic component(s)'20158,953,320'Coolant drip facilitating partial immersion-cooling of electronic components'20158,947,873'Immersion-cooled and conduction-cooled electronic system'20158,941,994'Vapor condenser with three-dimensional folded structure'20158,934,250'Immersion-cooling of selected electronic component(s) mounted to printed circuit board'20158,925,333'Thermoelectric-enhanced air and liquid cooling of an electronic system'20158,929,080'Immersion-cooling of selected electronic component(s) mounted to printed circuit board'20158,922,998'Coolant manifold with separately rotatable manifold section(s)'20148,913,384'Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)'20148,879,257'Combined power and cooling rack supporting an electronics rack(s)'20148,867,209'Two-phase, water-based immersion-cooling apparatus with passive deionization'20148,824,143'Combined power and cooling rack supporting an electronics rack(S)'20148,817,474'Multi-rack assembly with shared cooling unit'20148,817,465'Multi-rack assembly with shared cooling apparatus'20148,806,749'Two-phase, water-based immersion-cooling apparatus with passive deionization'20148,797,740'Multi-rack assembly method with shared cooling unit'20148,760,863'Multi-rack assembly with shared cooling apparatus'20148,739,406'Vapor condenser with three-dimensional folded structure'20148,743,545'Thermal expansion-enhanced heat sink for an electronic assembly'20148,720,063'Thermal expansion-enhanced heat sink for an electronic assembly'20148,713,955'Intra-condenser contaminant extractor for a vapor-compression refrigeration apparatus'20148,713,957'Thermoelectric-enhanced, vapor-condenser facilitating immersion-cooling of electronic component(s)'20148,711,563'Dry-cooling unit with gravity-assisted coolant flow'20148,619,425'Multi-fluid, two-phase immersion-cooling of electronic component(s)'20138,564,952'Flow boiling heat sink structure with vapor venting and condensing'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2021Patents assigned to IBM (144)· patent assignee history
2013–2018Patents assigned to DAVID MILNES P (26)· patent assignee history
2013–2016Patents assigned to SIMONS ROBERT E (22)· patent assignee history
2013–2015Patents assigned to CAMPBELL LEVI A (21)· patent assignee history
2013–2015Patents assigned to CHU RICHARD C (21)· patent assignee history
2013–2019Based in Fishkill, NY, US· patent location history
2017–2021Based in Poughkeepsie, NY, US· patent location history
2020–2021Based in New Paltz, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 144 | 2013–2021 |
| DAVID MILNES Pself | 26 | 2013–2018 |
| SIMONS ROBERT E | 22 | 2013–2016 |
| CAMPBELL LEVI A | 21 | 2013–2015 |
| CHU RICHARD C | 21 | 2013–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fishkill, New York, US | 123 | 2013–2019 |
| Poughkeepsie, New York, US | 18 | 2017–2021 |
| New Paltz, New York, US | 4 | 2020–2021 |