Inventor
AKIO NISHIDA
Inventor
JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Bprimary
H10BElectronic memory devices32%
H01LSemiconductor devices25%
H10DInorganic electric semiconductor devices18%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
G11CStatic stores7%
PatentTitleYear
12,101,936Three dimensional memory device and method of making thereof by forming channel and memory film after word line replacement202412,058,854Three-dimensional memory device with isolated source strips and method of making the same202411,889,684Three-dimensional memory device with separated source-side lines and method of making the same202411,791,327Three-dimensional memory device having support-die-assisted source power distribution and method of making thereof202311,587,943Bonded die assembly using a face-to-back oxide bonding and methods for making the same202311,393,836Three-dimensional memory device with separated source-side lines and method of making the same202211,276,708Three-dimensional device with bonded structures including a support die and methods of making the same202211,201,107Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer202111,195,781Bonded three-dimensional memory devices and methods of making the same by replacing carrier substrate with source layer2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to SANDISK TECHNOLOGIES LLC (9)· patent assignee history
2021–2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SANDISK TECHNOLOGIES LLC | 9 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 9 | 2021–2024 |